BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM20710A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
BCM4330GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM4330XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B225		.41 mm	4.89 mm					5.33 mm
BCM4325GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.25 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B339		.42 mm	5.81 mm					6.51 mm
BCM4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B160		1 mm	8 mm					8 mm
CYV15G0204TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYV15G0104TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM4356XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B395		.33 mm	4.87 mm					7.67 mm
BCM4319SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	138	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.225 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B138		.55 mm	4.53 mm					5.74 mm
BCM20713A1KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.22 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
BCM4330XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
BCM4339XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
BCM4329HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B182		.55 mm	5.62 mm					6.57 mm
BCM4318KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	75 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.4 mm	12 mm					12 mm
BCM4318SKFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	75 Cel	0 Cel		BOTTOM		S-PBGA-B144		1.4 mm	10 mm					10 mm
CYW88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
CYW89071A1CUBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.22 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
BCM43907KWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B316		.33 mm	4.907 mm					5.848 mm
CYV15G0203TB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM4334WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		.33 mm	4.08 mm					4.48 mm
BCM43353LIUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
BCM4330GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm					6.5 mm
BCM4334XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		.41 mm	4.08 mm					4.48 mm
BCM4354ZKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B192		.55 mm	4.87 mm					7.67 mm
BCM89359KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B194		.55 mm	4.97 mm					7.44 mm
BCM20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
BGS13S2N9E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1	MOS		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B9		.4 mm	1.1 mm					1.1 mm
CYW43353LIUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA145,12X12,16	.4 mm	85 Cel	-40 Cel		BOTTOM	433.3 Mbps	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
CYW4356XKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B192	1	.55 mm	4.87 mm					7.67 mm
CYW4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B286		.41 mm	4.87 mm					5.413 mm
CYW4343SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm					4.87 mm
CYW43362SKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYW20735KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	111	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B111		.97 mm	9 mm					9 mm
CYW43362KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYW4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B160		1 mm	8 mm					8 mm
CYW43362KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B69		.55 mm	2.92 mm					4.52 mm
CYW20707UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1.05 mm	4 mm					4.5 mm
CYW43362SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B69		.55 mm	2.92 mm					4.52 mm
CYW20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
CYW4343WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm					4.87 mm
CYW20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B121		1.1 mm	9 mm					9 mm
CYW20707UA2EKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	36	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B36		.55 mm	2.51 mm					2.77 mm
CYW4354XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			85 Cel	-30 Cel		BOTTOM		R-PBGA-B395		.33 mm	4.87 mm					7.67 mm
CYW20705B0KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B50		.8 mm	4 mm					4.5 mm
CYW43340XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B141		.55 mm	4.47 mm					5.67 mm
CYW4343WKWBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			70 Cel	-30 Cel		BOTTOM		R-PBGA-B153		.33 mm	2.87 mm					4.87 mm
CYW20706UA1KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B49	3	1.05 mm	4 mm		e1		260	4.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.