BALL Other Function Telecom Interface ICs 758

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CYW4354ZKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

192

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B192

.55 mm

4.87 mm

7.67 mm

CYW43438KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

.55 mm

2.87 mm

4.87 mm

CYW20710A1KUFBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

4 mm

4.5 mm

CYW20704UA2KFFB1G

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

49

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B49

1 mm

4 mm

4.5 mm

CYW43455XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

140

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B140

.6 mm

4.47 mm

5.27 mm

CYW20713A1KUBG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW4334WKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

208

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B208

.33 mm

4.08 mm

4.48 mm

CYW20702B0KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW4356XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

192

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B192

.55 mm

4.87 mm

7.67 mm

CYW4354XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

192

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B192

.55 mm

4.87 mm

7.67 mm

CYW4343W1KUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20702A1KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW4343SKUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20705A1KWFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.8 mm

4 mm

4.5 mm

CYW4373IUBGT

Infineon Technologies

TELECOM CIRCUIT

BALL

128

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA128,11X13,16

.4 mm

70 Cel

-20 Cel

BOTTOM

480 Mbps

R-PBGA-B128

.6 mm

4.51 mm

5.43 mm

CYW4343WKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

70 Cel

-30 Cel

BOTTOM

R-PBGA-B153

.33 mm

2.87 mm

4.87 mm

CYW20730A1KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B64

1 mm

7 mm

7 mm

CYW20730A2KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B64

1 mm

7 mm

7 mm

CYW43364KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20715A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW4339XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

145

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B145

.55 mm

4.87 mm

5.413 mm

CYW43340HKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

141

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B141

.55 mm

4.47 mm

5.67 mm

CYW4343W1KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B74

.55 mm

2.87 mm

4.87 mm

CYW20733A3KFB1G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

81

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B81

1.1 mm

8 mm

8 mm

CYW20710A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B50

.6 mm

2.509 mm

3.019 mm

CYW20713A1KUFBXG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

50

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B50

.6 mm

4 mm

4.5 mm

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

.7 mm

.99 mm

1.44 mm

IP4365CX11/P

Nexperia

TELECOM CIRCUIT

OTHER

BALL

11

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-35 Cel

BOTTOM

R-PBGA-B11

.65 mm

1.16 mm

1.56 mm

PI2EQX4402DNBEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

DS4000D0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GFN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GFN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31256+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS4000G0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000D0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS4000ECN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000EC/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31256

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS4000KIN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000KI/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GF/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CW/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.