BALL Other Function Telecom Interface ICs 758

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AVSP-8801-002

Broadcom

TELECOM CIRCUIT

BALL

169

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

8

CMOS

1 V

GRID ARRAY

BGA169(UNSPEC)

125 Cel

0 Cel

BOTTOM

28000 Mbps

R-PBGA-B169

ALSO AVAILABLE WITH 2.5V NOMINAL SUPPLY

BCM5676

Broadcom

TELECOM CIRCUIT

BALL

600

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B600

1

Not Qualified

BCM5345M

Broadcom

TELECOM CIRCUIT

BALL

676

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B676

Not Qualified

BCM4330XB2KFFBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA144,12X12,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

Not Qualified

6.5 mm

BCM5705M

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B196

1

Not Qualified

BCM5691

Broadcom

TELECOM CIRCUIT

BALL

480

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B480

1

Not Qualified

L-TTSI004321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM2141

Broadcom

TELECOM CIRCUIT

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.5 V

GRID ARRAY

BOTTOM

S-PBGA-B144

Not Qualified

BCM1112

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

HDMP-0528

Broadcom

TELECOM CIRCUIT

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

BOTTOM

S-PBGA-B289

19 mm

Not Qualified

19 mm

TTSI002321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM4325HKFBG

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B196

Not Qualified

BCM5801

Broadcom

TELECOM CIRCUIT

BALL

144

QFP

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

BOTTOM

X-PQFP-G144

1

Not Qualified

BCM5754

Broadcom

TELECOM CIRCUIT

BALL

100

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

X-PBGA-B100

TTSI004321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM4330FB2KFFBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA144,12X12,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

Not Qualified

6.5 mm

BCM5703

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B400

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM1115R

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

BCM53242M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM1115

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B256

1

Not Qualified

BCM1113

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

BCM21551

Broadcom

TELECOM CIRCUIT

BALL

621

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B621

Not Qualified

BCM5773

Broadcom

TELECOM CIRCUIT

BALL

680

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

X-PBGA-B680

Not Qualified

BCM4330HB2KUBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

133

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA133,12X12,16

Other Telecom ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B133

.55 mm

4.89 mm

Not Qualified

5.33 mm

BCM5703S

Broadcom

TELECOM CIRCUIT

BALL

300

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B300

1

Not Qualified

HDMP-1685A

Broadcom

TELECOM CIRCUIT

OTHER

BALL

208

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA208,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B208

1.65 mm

23 mm

Not Qualified

23 mm

BCM5680

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM6421

Broadcom

TELECOM CIRCUIT

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B208

1

23 mm

Not Qualified

23 mm

BCM2122

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

BCM2140

Broadcom

TELECOM CIRCUIT

BALL

180

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B180

1

Not Qualified

BCM5770R

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B324

1

Not Qualified

HDMP-3268

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY

1.27 mm

BOTTOM

S-PBGA-B400

3.23 mm

37.5 mm

Not Qualified

37.5 mm

BCM2132

Broadcom

TELECOM CIRCUIT

BALL

276

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

S-PBGA-B276

Not Qualified

BCM1111

Broadcom

TELECOM CIRCUIT

BALL

426

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

BOTTOM

X-PBGA-B426

Not Qualified

BCM2124

Broadcom

TELECOM CIRCUIT

BALL

296

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B296

Not Qualified

BCM5715C

Broadcom

TELECOM CIRCUIT

BALL

484

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

X-PBGA-B484

Not Qualified

BCM6411IPB

Broadcom

TELECOM CIRCUIT

BALL

336

SQUARE

PLASTIC/EPOXY

YES

1

BOTTOM

40 Mbps

S-PBGA-B336

KS8664B

Samsung

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5/3

GRID ARRAY

BGA196,14X14,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B196

Not Qualified

e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.