BALL Other Function Telecom Interface ICs 758

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCP-3033H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
LV0111CF	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B4		.68 mm	1.08 mm					1.08 mm
LC898212XC-MH	Onsemi	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.69 mm	1.37 mm		e1	30	260	1.77 mm
TCP-5112UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.993 mm
TCP-4127UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
TCP-5127XA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.94 mm
TCP-4182UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
LC898214XD-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.33 mm	1.15 mm		e1	30	260	2.37 mm
LC898214XC-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.45 mm	1.15 mm		e1	30	260	2.37 mm
TCP-3047N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-4127UA-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
TCP-3012H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.639 mm	.722 mm					.879 mm
FIN210ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B42		1 mm	3.5 mm					4.5 mm
TCP-3027H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
TCP-3047H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-4139UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
TCP-5118UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.993 mm
TCP-3082H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
FSA9480UCX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B25		.625 mm	2.1 mm					2.1 mm
TCP-3039N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm					1.029 mm
TCP-3033N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm					1.029 mm
TCP-5156UA-DT	Onsemi	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm		e1	5	260	.993 mm
TCP-4147UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.964 mm
TCP-3027N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
TCP-4168UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
TCP-4112UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
NL3HS644BFCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
TCP-3039H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm					1.029 mm
TCP-3056H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
LC898212XD-SH	Onsemi	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.69 mm	1.37 mm		e1	30	260	1.77 mm
TCP-3056N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-3068H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm					1.179 mm
NCH-RSL10-101WC51-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	51	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA51,11X11,10		.252 mm	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2 Mbps	R-PBGA-B51	1	.381 mm	2.325 mm		e2	30	260	2.364 mm
M7010R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STHVDAC-253MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B16		.64 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
STI5300AUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY							BOTTOM		S-PBGA-B336				Not Qualified
STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B676				Not Qualified
M7040N-100ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	24 Mbps	S-PBGA-B208		1.7 mm	17 mm	Not Qualified	e1			17 mm
STLC2415	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B120		1.4 mm	10 mm	Not Qualified				10 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.64 mm	1.94 mm			NOT SPECIFIED	NOT SPECIFIED	2.23 mm
STLC60844	STMicroelectronics	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	8	BICMOS	3.3 V		GRID ARRAY							BOTTOM		S-PBGA-B196				Not Qualified
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
E-ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B208		1.7 mm	17 mm	Not Qualified				17 mm
M7040N-100ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
M7010R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STLC2500ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified				6 mm
STA8058A	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS		2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.