BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
WL1801MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.7 V		GRID ARRAY				70 Cel	-20 Cel		BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
ADL5506ACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm	.79 mm			e1	30	260	1.19 mm
PM5990B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1932
CYW43455XKUBGT	Infineon Technologies	TELECOM CIRCUIT		BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA140,11X13,16		.4 mm	85 Cel	-30 Cel		BOTTOM	433.3 Mbps	R-PBGA-B140	1	.6 mm	4.47 mm						5.27 mm
HMC6301BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	75	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.35 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B75	1	.815 mm	4 mm				30	260	6 mm
PI2EQX4402DNBE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified		e1			9 mm
CYW20706UA1KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.5 mm
CYW4343WKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm						4.87 mm
SJA1105TEL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1		260	12 mm
BC57G687C-ANN-E4	Qualcomm	TELECOM CIRCUIT		BALL	105	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA105,11X11,32		.8 mm	85 Cel	-40 Cel		BOTTOM	12 Mbps	S-PBGA-B105		1.6 mm	10 mm						10 mm
BCM4330FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm						6.5 mm
BCM43438KUBGT	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63		.55 mm	2.87 mm						4.87 mm
BCM43455XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B140		.6 mm	4.47 mm						5.27 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16		.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm		Also has 1.2 V core supply				10 mm
BCM5389KFBG	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY							BOTTOM		S-PBGA-B256							NOT SPECIFIED	NOT SPECIFIED
PM5440B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1894	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1894
AD6652BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified		e1		260	17 mm
FIDO5200BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
PM5981B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1932
VSC8484YJP	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY			1 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B324		2.74 mm	18.6 mm						18.6 mm
LMX5452SM/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
GC4016-PBZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B160	3	1.75 mm	15 mm	Not Qualified		e1	30	260	15 mm
LM3291TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B12	1	.675 mm				e1	30	260
LMV1099TLX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-XBGA-B25	1	.675 mm	2.64 mm			e1	30	260	2.764 mm
GC4016-PB-ASY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B160		1.75 mm	15 mm	Not Qualified					15 mm
LMX5453SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm			e1	30	260	9 mm
TPS657201YFFR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm			e1	30	260	2.086 mm
XA2243PBGABL	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA161		.65 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B161	3	1.17 mm	10.4 mm			e1	30	260	10.4 mm
LMV243BL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	8	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B8		1.095 mm	1.514 mm						1.514 mm
LM3290TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B30	1	.675 mm				e1	30	260
LMX5452SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
TPS65720YFFR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B25	1	.625 mm	2.3 mm	Not Qualified		e1	NOT SPECIFIED	260	2.3 mm
GC4116-PBZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B160	3	2.05 mm	15 mm	Not Qualified		e1	30	260	15 mm
GC5328IZER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484	4	2.48 mm	23 mm	Not Qualified		e1	30	260	23 mm
TPS657202YFFR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm			e1	30	260	2.086 mm
LM96511CCSM/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	376	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B376	4	1.2 mm	10 mm			e0	30	260	17 mm
TPS657052YZHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified		e1	NOT SPECIFIED	260	2.3 mm
HPA01195YFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
TPS657201YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm			e1	30	260	2.086 mm
TLK4015AIGPV	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified		e0	20	220	19 mm
TPS657052YZHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified		e1	NOT SPECIFIED	260	2.3 mm
WL1831GYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	130	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA130,11X12,16		.4 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B130	1	.575 mm	4.64 mm			e1	30	260	4.93 mm
TCA5013ENG	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B48		.94 mm	5 mm						5 mm
LMX5453SM/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	12 Mbps	R-PBGA-B60	4	1.3 mm	6 mm			e1	30	260	9 mm
XWL1805MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.7 V		GRID ARRAY				70 Cel	-20 Cel		BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TLK4015AIZPV	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified		e1	30	260	19 mm
TPS65720YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B25	1	.625 mm	2.3 mm	Not Qualified		e1	NOT SPECIFIED	260	2.3 mm
GC4116-PB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B160	3	2.05 mm	15 mm	Not Qualified		e0	20	220	15 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.