DIP Telephone Line ICs 377

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Make-break Ratio	Length
935263379112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		3.6 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified							19.025 mm
PCD3344P/004	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4			3:2	35.5 mm
935008900112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T14		4.2 mm	7.62 mm	Not Qualified				40	245		19.025 mm
PCD3347P/001	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4			3:2	26.73 mm
PCD3344P/011	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4			3:2	35.5 mm
PCD3311CPN	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T14		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	19.025 mm
PCD3321CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
933821300112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		2.8 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified				40	245		21.6 mm
PCD3331-1P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2	26.73 mm
PCD3310GP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified						1:2	26.73 mm
PCD3325CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3311PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		1.2 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T14		4.7 mm	7.62 mm	Not Qualified
PCD3324CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3360P	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.14 mA	6 V	6	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified							19.025 mm
PCD4415PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified			e3/e4			1:2
PCD4415APN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified			e3/e4			1:1.5
PCD3310HP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified						1:2	26.73 mm
935008920112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				40	250		9.5 mm
PCD3332-1P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2	35.5 mm
PCD3322CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3310CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified						1:2	26.73 mm
PCD3312CP	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0009 mA	3 V	3/5	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		3.58					9.5 mm
PCD3320CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-GDIP-T18		5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3326CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
PCD3327CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18		4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5	21.6 mm
935230190112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			2.7 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		4.32 mm	7.62 mm	Not Qualified			e4				38.1 mm
935207840112	NXP Semiconductors	SPEAKER PHONE CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified							31.7 mm
PCD3349P/018	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4			3:2	35.5 mm
PCD3310APN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified						1:1.5	26.73 mm
PCD3312CPN	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	9.5 mm
PCD3321CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-GDIP-T18		5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2					1:1.5
PCD3310P	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.9 mA	5 V	3/5	IN-LINE	DIP20,.3	Telephone Circuits	2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified		3.58				1:2	26.73 mm
PCD3332-2P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2					2:1	35.5 mm
MC33219AP	NXP Semiconductors	SPEAKER PHONE CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T24		4.44 mm	7.62 mm								31.69 mm
MC34017AP	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T8		5.334 mm	7.62 mm	Not Qualified							9.78 mm
MC34017P	NXP Semiconductors	TELEPHONE RINGER CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T8		4.45 mm	7.62 mm	Not Qualified							9.78 mm
MC33218AP	NXP Semiconductors	SPEAKER PHONE CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	6 mA	5 V	5	IN-LINE	DIP24,.3	Telephone Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T24		4.44 mm	7.62 mm	Not Qualified			e0				31.69 mm
MC14LC5447P	NXP Semiconductors	TELEPHONE CALLING NO IDENTIFICATION CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5.5 mA	5 V	5	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T16		4.44 mm	7.62 mm	Not Qualified			e0				19.175 mm
TEA1110A	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	1.4 mA	2.9 V	2.9	IN-LINE	DIP14,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T14		4.2 mm	7.62 mm	Not Qualified				40	245		19.025 mm
TEA1095PN	NXP Semiconductors	SPEAKER PHONE CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		3.8 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified							31.7 mm
TEA1062AM1	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	1.35 mA	3.4 V	2.7	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified							19.025 mm
TEA1062A	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	1.35 mA	3.4 V	3.4	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T16		4.7 mm	7.62 mm	Not Qualified				40	245		21.6 mm
TEA1062M1	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	1.35 mA	3.4 V	3.4	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified			e3/e4				19.025 mm
TEA1112AN	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		1.4 mA	2.9 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified							19.025 mm
TEA1064AN	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		2.8 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	AVAILABLE ONLY IN NORTH AMERICA						26.73 mm
TEA1062/C4/M1,112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			2.7 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16	1	4.32 mm	7.62 mm	Not Qualified			e4				38.1 mm
TEA1112A	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	.0014 mA	2.9 V	2.9	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T16				Not Qualified
TEA1112	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	.0014 mA	2.9 V	2.9	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T16				Not Qualified

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.