TELEPHONE MULTIFUNCTION CIRCUIT Telephone Line ICs 91

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Repertory	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Make-break Ratio	Length
935260608118	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA1702AT-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2 mA	3.3 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified			e4				17.9 mm
UBA2051AT/C1	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
PCD3311CTD	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.9 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	10.3 mm
935260607118	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
935008900112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T14		4.2 mm	7.62 mm	Not Qualified				40	245		19.025 mm
935008910118	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				40	260		10.3 mm
PCD3311CPN	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T14		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	19.025 mm
935260687112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA2051AT	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA1702AT	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2 mA	3.3 V	3.3	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified							17.9 mm
PCD3331-1P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2	26.73 mm
PCD3332-3T-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1.8 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2					2:1	17.9 mm
UBA2050T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
935260690118	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA2050AT	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified			e4			2:3	17.9 mm
935008930112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified				40	260		7.55 mm
PCD3332-2TD-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified							17.9 mm
PCD3332-1T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2	17.9 mm
PCD3312CTD	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.9 mA	3 V	3/5	SMALL OUTLINE	SOP8,.25	Telephone Circuits	1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3	3.58				1:1	7.55 mm
UBA2051CT	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA2050AT/C1	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
PCD3332-2T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1.8 mA	5 V	3/5	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	70 Cel	REPERTORY	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2	3.58				2:1	17.9 mm
935008920112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		3 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				40	250		9.5 mm
935008910112	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				40	260		10.3 mm
PCD3332-1P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1					3:2	35.5 mm
UBA2052T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified			e4			2:3	20.5 mm
PCD3312CTD-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.9 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	7.55 mm
PCD3330-1T-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1.6 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2		e4			2:1	17.9 mm
PCD3312CP	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.0009 mA	3 V	3/5	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		3.58					9.5 mm
PCD3332-ST-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1.8 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2		e4			2:1	17.9 mm
UBA2051T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
UBA1702T-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2 mA	3.3 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified			e4				17.9 mm
UBA2050T/C1	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified						2:3	17.9 mm
PCD3312CPN	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:3					1:1	9.5 mm
UBA1702T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2 mA	3.3 V	3.3	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified							17.9 mm
PCD3311CT	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0009 mA	3 V	3/5	SMALL OUTLINE	SOP16,.4	Telephone Circuits	1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified		3.58					10.3 mm
PCD3332-2P	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V		IN-LINE			2.54 mm	70 Cel		-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 3:2					2:1	35.5 mm
TEA1069H-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK			.8 mm	75 Cel		-25 Cel	TIN	QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT		e3			2:1	10 mm
TEA1069N	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	.0018 mA	2.7 V	3	IN-LINE, SHRINK PITCH	SDIP42,.6	Telephone Circuits	1.778 mm	75 Cel		-25 Cel		DUAL	R-PDIP-T42	1	5.08 mm	15.24 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT					2:1	38.65 mm
TEA1069H	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0018 mA	2.7 V	3	FLATPACK	QFP44,.5SQ,32	Telephone Circuits	.8 mm	75 Cel		-25 Cel		QUAD	S-PQFP-G44	1	2.1 mm	10 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT					2:1	10 mm
TEA1069AH	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		2.7 V		FLATPACK	QFP44,.5SQ,32	Telephone Circuits	.8 mm	75 Cel		-25 Cel	TIN	QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT		e3			2:1	10 mm
TEA1069AH-T	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK			.8 mm	75 Cel		-25 Cel	TIN	QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT		e3			2:1	10 mm

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.