Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
SEPARATE |
5 |
16 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.12,20 |
8 |
100 |
.5 mm |
85 Cel |
NO |
3-STATE |
64X16 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
HARDWARE |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
2 MHz |
2 mm |
5 ms |
3-WIRE |
1024 bit |
4.5 V |
ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN |
e4 |
40 |
260 |
.000015 Amp |
3 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
1 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.7 V |
IT CAN ALSO CONFIGURABLE AS 256 X 8 |
e3 |
260 |
.00001 Amp |
9.271 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
1.8/5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
8 |
EEPROMs |
100 |
.65 mm |
85 Cel |
NO |
3-STATE |
256X16 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
2 MHz |
3 mm |
Not Qualified |
5 ms |
MICROWIRE |
4096 bit |
4.5 V |
ALSO OPERATES WITH 1.7V-5.5V AND 2.5V-5.5V SUPPLY |
e4 |
40 |
260 |
.000001 Amp |
4.4 mm |
1.8 |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
2/5 |
16 |
SMALL OUTLINE |
SOP8,.23 |
8 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
10 ms |
MICROWIRE |
16384 bit |
1.8 V |
OPERATES AT 250 KHz AT MIN 1.8V |
e3 |
40 |
260 |
.000001 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
ROHM |
EEPROM |
I2C |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4096 words |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
5.5 V |
1.71 mm |
.4 MHz |
4.4 mm |
5 ms |
I2C |
32768 bit |
1.6 V |
SEATED HGT CALCULATED |
e3 |
5 mm |
||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.71 mm |
1 MHz |
4.4 mm |
5 ms |
I2C |
65536 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
TIN COPPER |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.71 mm |
1000000 Write/Erase Cycles |
.4 MHz |
4.4 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.8 V |
e2 |
10 |
260 |
.000002 Amp |
5 mm |
|||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.16 |
EEPROMs |
40 |
.65 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
TIN COPPER |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.095 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2.8 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
e2 |
10 |
260 |
.000002 Amp |
2.9 mm |
||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
2.5 |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-N8 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2 mm |
Not Qualified |
5 ms |
MICROWIRE |
1024 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
3 mm |
||||||||||||||||||||||||
|
ROHM |
EEPROM |
AUTOMOTIVE |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
125 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.65 mm |
5 MHz |
3.9 mm |
4 ms |
SPI |
65536 bit |
2.5 V |
SEATED HT-CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
2.5 |
2/5 |
16 |
SMALL OUTLINE, LOW PROFILE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
DUAL |
SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.6 mm |
1000000 Write/Erase Cycles |
2 MHz |
4.4 mm |
Not Qualified |
5 ms |
MICROWIRE |
4096 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
5 mm |
|||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
3.3 |
2/5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.7 V |
e4 |
260 |
.000001 Amp |
4.4 mm |
||||||||||||||||||||||
|
Catalyst Semiconductor |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1 mA |
128 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.635 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
1024 bit |
.000002 Amp |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
1.8/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
.000001 Amp |
4.9 mm |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
EEPROMs |
100 |
.65 mm |
125 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
S-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.8 V |
e4 |
.000005 Amp |
3 mm |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2.5 mA |
65536 words |
3.3 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
NO |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
e4 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
8 |
SMALL OUTLINE |
SOP8,.25 |
100 |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
10 ms |
I2C |
65536 bit |
2.5 V |
.000001 Amp |
4.9 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
EEPROMs |
100 |
.65 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
10 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
1024 bit |
2.5 V |
e4 |
30 |
260 |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
5 MHz |
3.9 mm |
Not Qualified |
5 ms |
SPI |
16384 bit |
1.8 V |
100 YEAR DATA RETENTION |
e4 |
30 |
260 |
.000002 Amp |
4.9 mm |
|||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
Tin (Sn) |
DUAL |
R-PDIP-T24 |
5.5 V |
6.35 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
16384 bit |
4.5 V |
e3 |
.0001 Amp |
31.875 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
NO |
TIN |
DUAL |
R-PDSO-G24 |
1 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
15.4 mm |
200 ns |
5 |
YES |
|||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
5 ms |
16384 bit |
4.5 V |
NOT SPECIFIED |
260 |
.0001 Amp |
15.4 mm |
90 ns |
5 |
YES |
||||||||||||||||||||||||
|
Catalyst Semiconductor |
EEPROM |
INDUSTRIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
5 ms |
16384 bit |
4.5 V |
e3 |
.0001 Amp |
15.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Catalyst Semiconductor |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e0 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e0 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Rochester Electronics |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
e3 |
11.8 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
16 words |
5 |
1.8/5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
NO |
16X16 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
YES |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
256 bit |
1.7 V |
100 YEAR DATA RETENTION |
16 |
e4 |
30 |
260 |
.000001 Amp |
4.4 mm |
||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1 mA |
64 words |
2/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
TIN |
DUAL |
SOFTWARE |
R-PDSO-G8 |
1 |
1000000 Write/Erase Cycles |
Not Qualified |
MICROWIRE |
1024 bit |
e3 |
260 |
.000001 Amp |
||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
64 words |
5 |
2/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
1 ms |
MICROWIRE |
1024 bit |
1.8 V |
100 YEAR DATA RETENTION |
e4 |
30 |
260 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
100 |
1.27 mm |
125 Cel |
1KX8 |
1K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
10 MHz |
3.9 mm |
5 ms |
SPI |
8192 bit |
2.5 V |
100 YEAR DATA RETENTION |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.000005 Amp |
4.9 mm |
|||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
5 |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
125 Cel |
4KX8 |
4K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
10 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
32768 bit |
2.5 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.000004 Amp |
4.4 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.8 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
.39 mm |
10 MHz |
3.9 mm |
5 ms |
SPI |
1048576 bit |
2.5 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
LSOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
32 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE |
SOC6,.17 |
EEPROMs |
1.27 mm |
85 Cel |
32X8 |
32 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
6 V |
1.5 mm |
100000 Write/Erase Cycles |
.0163 MHz |
3.76 mm |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
3.94 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
256 words |
3.3 |
3/5 |
4 |
GRID ARRAY |
BGA6,2X3,40/20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
NO |
OPEN-DRAIN |
256X4 |
256 |
-40 Cel |
NO |
TIN SILVER COPPER NICKEL |
BOTTOM |
HARDWARE |
R-PBGA-B6 |
1 |
5.25 V |
.98 mm |
50000 Write/Erase Cycles |
1.68 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e2 |
30 |
260 |
1.68 mm |
NO |
|||||||||||||||||||||
|
Analog Devices |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
64 words |
3.3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64X1 |
64 |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-C6 |
1 |
3.63 V |
1.5 mm |
3.94 mm |
1-WIRE |
64 bit |
2.75 V |
e3 |
30 |
260 |
4.29 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
EEPROM |
INDUSTRIAL |
3 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.4 mA |
64 words |
3.3 |
3/3.3 |
1 |
SMALL OUTLINE |
TO-236 |
EEPROMs |
10 |
.95 mm |
85 Cel |
64X1 |
64 |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
3.63 V |
1.12 mm |
1000 Write/Erase Cycles |
1.3 mm |
Not Qualified |
1-WIRE |
64 bit |
2.97 V |
e3 |
30 |
260 |
2.92 mm |
||||||||||||||||||||||||||
|
Fremont Micro Devices |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1 MHz |
3.9 mm |
5 ms |
I2C |
4096 bit |
2.5 V |
IT ALSO HAVE FREQUENCY 0.4 MHZ OPERATES AT 1.8V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
Fremont Micro Devices |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.1 mm |
1 MHz |
3 mm |
5 ms |
I2C |
4096 bit |
2.5 V |
IT ALSO HAVE FREQUENCY 0.4 MHZ OPERATES AT 1.8V |
NOT SPECIFIED |
NOT SPECIFIED |
4.4 mm |
|||||||||||||||||||||||||||||||||
Holtek Semiconductor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
5 mA |
8192 words |
2.5/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
65536 bit |
.000004 Amp |
|||||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
e3 |
10 |
260 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
65536 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
125 Cel |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
4000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
4 ms |
I2C |
524288 bit |
1.8 V |
e4 |
260 |
.00001 Amp |
4.9 mm |
5 |
||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.8 mA |
128 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.8 V |
e4 |
.000001 Amp |
4.4 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.8 mA |
128 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.8 V |
e4 |
30 |
260 |
.000001 Amp |
4.9 mm |
|||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
50 |
.65 mm |
125 Cel |
TOTEM POLE |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1 MHz |
3 mm |
4 ms |
I2C |
2048 bit |
1.7 V |
4.4 mm |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
50 |
1.27 mm |
105 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
900000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
4 ms |
I2C |
2048 bit |
1.8 V |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1 MHz |
3.9 mm |
4 ms |
I2C |
4096 bit |
1.7 V |
4.9 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.