Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

RC28F320J3F75B

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

80 mA

2097152 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

32

YES

Tin/Lead/Silver (Sn/Pb/Ag)

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

33554432 bit

2.7 V

4/8

e0

30

235

NOR TYPE

.00012 Amp

13 mm

YES

75 ns

2.7

NO

M29F800FT55N6S

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

M45PE40-VMP6T

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

524288 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-XDSO-N8

3.6 V

1 mm

33 MHz

5 mm

Not Qualified

4194304 bit

2.7 V

30

235

NOR TYPE

6 mm

2.7

MQAT040A

Micron Technology

FLASH CARD

COMMERCIAL

50

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

41943040 words

3.3

8

MICROELECTRONIC ASSEMBLY

60 Cel

40MX8

40M

0 Cel

UNSPECIFIED

X-XXMA-X50

3.6 V

Not Qualified

335544320 bit

3 V

ALSO WORKS WITH 5V VCC

NOR TYPE

3

M29W640GT70NB3E

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

10 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

125 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

TOP

67108864 bit

2.7 V

4/8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFDDAK200MAR-1J1AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDCAE008SAF-1C1IT

Micron Technology

FLASH MODULE

INDUSTRIAL

XMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SERIAL

ASYNCHRONOUS

120 mA

8589934592 words

5

8

MICROELECTRONIC ASSEMBLY

85 Cel

8GX8

8G

-40 Cel

UNSPECIFIED

R-XXMA-X

5.25 V

9.7 mm

26.6 mm

68719476736 bit

4.75 V

SLC NAND TYPE

.06 Amp

36.9 mm

5

M29W800FB7AZA6T

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

524288 words

3.3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

BOTTOM

R-PBGA-B48

1

3.6 V

1.2 mm

6 mm

Not Qualified

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

.0001 Amp

8 mm

YES

70 ns

3

YES

M29W320DB80N6T

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

33554432 bit

2.5 V

NOR TYPE

18.4 mm

80 ns

3

RC28F128J3F75B

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

80 mA

8388608 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

Tin/Lead (Sn63Pb37)

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

134217728 bit

2.7 V

4/8

e0

30

235

NOR TYPE

.00012 Amp

13 mm

YES

75 ns

2.7

NO

M29F800FB55N3S

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAK480MAV-1AE12ZZ

Micron Technology

FLASH MODULE

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.5 mm

5

M29W320DB80N6F

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

33554432 bit

2.5 V

NOR TYPE

18.4 mm

80 ns

3

M29W128GH70ZS1F

Micron Technology

FLASH

COMMERCIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

8192 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

70 Cel

8KX16

8K

0 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

131072 bit

2.7 V

8/16

e1

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

M29W320FT70N3F6

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

10 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

33554432 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W160EB90ZS6E

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

1MX16

1M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

13 mm

90 ns

3

M29W640GT7ANB3E

Micron Technology

FLASH

3

MTFDDAA128MAM-1K12AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29F800FB5AN6S

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAA256MAM-1J2AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAA128MAM-1J22AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAC064MAM-1K12AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W400FB7AZA6F

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

4194304 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W160ET80ZS3

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

1MX16

1M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

TOP

16777216 bit

2.7 V

NOR TYPE

13 mm

70 ns

3

M29F200FT5AN6T2

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

131072 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

TOP

2097152 bit

4.5 V

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

MTFDDAT256MAR-1K1AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAC064MAM-1J11AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29F160FT55N3E2

Micron Technology

FLASH

AUTOMOTIVE

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

TOP

16777216 bit

4.5 V

TOP BOOT BLOCK

e3

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

MTFDDAT064MAM1J11AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAT480MAV-1AE12ZZHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M29W160ET70N3T

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

1MX16

1M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

16777216 bit

2.7 V

NOR TYPE

18.4 mm

70 ns

3

PH28F256L18B85

Micron Technology

FLASH

OTHER

79

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

50 mA

16777216 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA79,7X13,30

8

Flash Memories

.75 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B79

2 V

1 mm

9 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

4

e1

NOR TYPE

.00011 Amp

11 mm

YES

85 ns

1.8

NO

M29F400FB55M6S

Micron Technology

FLASH

INDUSTRIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G44

Not Qualified

BOTTOM

4194304 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

RD48F5000M0YBC0

Micron Technology

FLASH

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA107,9X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

256

NO

BOTTOM

R-PBGA-B107

Not Qualified

BOTTOM

536870912 bit

16

NOR TYPE

.00003 Amp

YES

96 ns

NO

RD48F3000L0YTQ0

Micron Technology

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

8388608 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-25 Cel

4,127

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

134217728 bit

4

NOR TYPE

YES

85 ns

NO

M29W800FT70ZA3ST

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

512KX16

512K

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

TOP

8388608 bit

3 V

TOP BOOT BLOCK

NOR TYPE

8 mm

70 ns

3

MTFDDAT240MAV-2AE1ZAB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29F800FB55N32

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

BOTTOM

8388608 bit

4.5 V

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

M29W640GH6AZA6E

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

67108864 bit

2.7 V

NOR TYPE

8 mm

60 ns

3

M29W400FT5AZA3T

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

262144 words

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

256KX16

256K

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

TOP

4194304 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

8 mm

55 ns

3

RC28F640J3F75

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

54 mA

4194304 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

64

YES

TIN LEAD SILVER

YES

BOTTOM

R-PBGA-B64

1

3.6 V

1.2 mm

10 mm

Not Qualified

67108864 bit

2.7 V

4/8

e0

NOR TYPE

.00012 Amp

13 mm

YES

75 ns

2.7

NO

M29W400DB45N3

Micron Technology

FLASH

3

MTFDDAA256MAM-1J2AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W640GB60NA3E

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

60 ns

3

M29W160FB80N3SF6

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

10 mA

1048576 words

YES

2.7/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

16777216 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

M58WR032KT70ZB6E

Micron Technology

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,7X8,30

Flash Memories

.75 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

2 V

1 mm

7.7 mm

Not Qualified

TOP

33554432 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

4

e1

NOR TYPE

.00005 Amp

9 mm

YES

70 ns

1.8

NO

M58BW016FB7T3FF

Micron Technology

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

524288 words

3

32

FLATPACK

.8 mm

125 Cel

512KX32

512K

-40 Cel

QUAD

R-PQFP-G80

3.6 V

3.4 mm

14 mm

BOTTOM

16777216 bit

2.7 V

NOR TYPE

20 mm

70 ns

3

M29W064FT60ZB6F

Micron Technology

FLASH

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.