Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M29W256GL60ZA3E

Micron Technology

FLASH

AUTOMOTIVE

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, THIN PROFILE

8

1 mm

125 Cel

16MX16

16M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

BOTTOM/TOP

268435456 bit

2.7 V

NOR TYPE

13 mm

60 ns

3

M29W160FB70N3F6

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

10 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

16777216 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W160EB70ZS3ST

Micron Technology

FLASH

3

M29W640GB7AZF6E

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

4/8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

MTFDHAX800MCE-1AN1ZABYY

Micron Technology

FLASH MODULE

COMMERCIAL

1

CMOS

UNSPECIFIED

SYNCHRONOUS

3.3

8

MICROELECTRONIC ASSEMBLY

55 Cel

800GX8

800G

0 Cel

UNSPECIFIED

R-XXMA-X

3.564 V

3.036 V

SOLID STATE DRIVE

NAND TYPE

M29W640GB7AZA6E

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

BOTTOM

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

70 ns

3

MTFDDAC100SAL1AB1

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M58WR016KB70ZQ6E

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

1048576 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM

16777216 bit

4

NOR TYPE

.00005 Amp

YES

70 ns

NO

MTFDDAA050MAR-1J12

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDHBA400TDG-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

429496729600 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

400GX8

400G

0 Cel

UNSPECIFIED

R-XXMA-N

3435973836800 bit

TLC NAND TYPE

M29W320FB80ZA3SF6

Micron Technology

FLASH

AUTOMOTIVE

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

10 mA

2097152 words

YES

2.7/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

125 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

33554432 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

MTFDDAK240MAV-1AE12ABHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

257698037760 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

240GX8

240G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

2061584302080 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTFDDAA400MAR-1J12

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M58WR016KT70ZB6F

Micron Technology

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

1048576 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,7X8,30

Flash Memories

.75 mm

85 Cel

1MX16

1M

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

2 V

1 mm

7.7 mm

Not Qualified

TOP

16777216 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

4

e1

NOR TYPE

.00005 Amp

9 mm

YES

70 ns

1.8

NO

MTFDDAK120MAV-1AH11ACYY

Micron Technology

FLASH

CMOS

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

5

RC28F320C3BD90

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

18 mA

2097152 words

3

NO

1.8/3.3,3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

8,31

YES

TIN LEAD SILVER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

e0

NOR TYPE

.00002 Amp

13 mm

YES

90 ns

3

NO

M29F800FB5AN6F2T

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

512KX16

512K

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

BOTTOM

8388608 bit

4.5 V

BOTTOM BOOT BLOCK

e3

NOR TYPE

18.4 mm

55 ns

5

MTFDDAA128MAM-1K1AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W640GB7AZA6F

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

4/8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

8 mm

YES

70 ns

3

YES

M29W160EB80N3SF

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

10 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

16777216 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

MTFDDAT480MAV-1AE11ZHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTFDHBE1T6TDG-1AW4ZABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1759218604441 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

1.6TX8

1.6T

0 Cel

UNSPECIFIED

R-XXMA-N

14073748835532 bit

TLC NAND TYPE

M29W256GL7AN1E

Micron Technology

FLASH

COMMERCIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

70 Cel

16MX16

16M

0 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

268435456 bit

2.7 V

NOR TYPE

18.4 mm

70 ns

3

M29W064FT6AN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

67108864 bit

2.7 V

NOR TYPE

18.4 mm

60 ns

3

M29W320DB80N3

Micron Technology

FLASH

AUTOMOTIVE

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

125 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

33554432 bit

2.7 V

18.4 mm

80 ns

3

RD48F5000M0YWB0

Micron Technology

FLASH

OTHER

105

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA105,9X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

256

NO

BOTTOM

R-PBGA-B105

Not Qualified

TOP

536870912 bit

NOR TYPE

.00003 Amp

YES

96 ns

NO

MTFDDAK480MAV-1AE11ABYY

Micron Technology

FLASH

COMMERCIAL

22

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N22

7 mm

69.85 mm

MLC NAND TYPE

100.5 mm

3.3

M29W160EB70ZS3T

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

1MX16

1M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM

16777216 bit

2.7 V

NOR TYPE

13 mm

70 ns

3

MTFDDAK960MAV-2AE11ACYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W640GL60ZF3F

Micron Technology

FLASH

AUTOMOTIVE

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

13 mm

60 ns

3

M29W160FB80NSF

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

16777216 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

M29W400FB55N3T

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

262144 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G48

1

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

4194304 bit

3 V

BOTTOM BOOT BLOCK

NOR TYPE

.0001 Amp

18.4 mm

YES

55 ns

3

YES

MTCF008A-XXX

Micron Technology

FLASH CARD

COMMERCIAL

50

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

4194304 words

3.3

16

MICROELECTRONIC ASSEMBLY

60 Cel

4MX16

4M

0 Cel

UNSPECIFIED

X-XXMA-X50

3.465 V

Not Qualified

67108864 bit

3.135 V

CAN ALSO OPERATE WITH 5V SUPPLY

NOR TYPE

3.3

M29W800FB90N6T

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.0001 Amp

YES

90 ns

YES

M29W160ET7AN6T

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

1MX16

1M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

16777216 bit

2.7 V

NOR TYPE

18.4 mm

70 ns

3

M29W640GB90ZS3F

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

13 mm

90 ns

3

M29F800FB55N3F

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAK120MAV-1AE11ZYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

128849018880 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

120GX8

120G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

1030792151040 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M29W640GB6ANA3E

Micron Technology

FLASH

3

M29W400FB55N3SE

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

256KX16

256K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

4194304 bit

3 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

55 ns

3

MTCF015A

Micron Technology

FLASH CARD

COMMERCIAL

50

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

15728640 words

3.3

8

MICROELECTRONIC ASSEMBLY

60 Cel

15MX8

15M

0 Cel

UNSPECIFIED

X-XXMA-X50

3.6 V

Not Qualified

125829120 bit

3 V

ALSO BE OPERATED WITH 4.5-5.5V SUPPLY

NOR TYPE

3

M45PE10S-VMN6TP

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

131072 words

8

SMALL OUTLINE

1.27 mm

85 Cel

128KX8

128K

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

75 MHz

3.9 mm

23 ms

1048576 bit

2.7 V

NOR TYPE

4.9 mm

2.7

M29W640GT6ANA3E

Micron Technology

FLASH

3

M29W160ET70ZS6E

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

M29W320DB70N3T

Micron Technology

FLASH

AUTOMOTIVE

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

2097152 words

3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

RC28F256P30T85

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX16

16M

-40 Cel

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

13 mm

88 ns

1.8

MTFDDAT240MAV-1AE12ACYY

Micron Technology

FLASH

COMMERCIAL

52

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N52

3.7 mm

29.85 mm

MLC NAND TYPE

50.8 mm

3.3

M58WR032KT7AZB6F

Micron Technology

FLASH

INDUSTRIAL

56

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

2097152 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA56,7X8,30

Flash Memories

.75 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

BOTTOM

R-PBGA-B56

Not Qualified

TOP

33554432 bit

4

NOR TYPE

.00005 Amp

YES

70 ns

NO

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.