Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M29W400FT70ZA6T

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

3.3

YES

3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

4194304 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

MTFDDAT064MAR-1K11AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK240MAV-1AE11ZHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

257698037760 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

240GX8

240G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

2061584302080 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTFDHAK1T9MCH-1AN1ZABYY

Micron Technology

FLASH

CMOS

12

MTFDDAT240MAV-2AH1ZAA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W256GL7AZS3E

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

16MX16

16M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM/TOP

268435456 bit

2.7 V

NOR TYPE

13 mm

70 ns

3

M45PE40-VMP6

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

524288 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-XDSO-N8

3.6 V

1 mm

33 MHz

5 mm

Not Qualified

4194304 bit

2.7 V

30

235

NOR TYPE

6 mm

2.7

RD48F3000M0YFC0

Micron Technology

FLASH

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

8388608 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA107,9X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-30 Cel

64

NO

BOTTOM

R-PBGA-B107

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00003 Amp

YES

96 ns

NO

MTFDDAT480MAV-2AE11ACYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W064FB6AN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

67108864 bit

2.7 V

NOR TYPE

18.4 mm

60 ns

3

M29W640GT7ANB6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

TOP

67108864 bit

2.7 V

4/8

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFDDAK480MAV-2AH1ZAC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAK128MAM-1K2

Micron Technology

FLASH

CMOS

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

5

M29W320DT80N6E

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

33554432 bit

2.5 V

NOR TYPE

18.4 mm

80 ns

3

M29F800FB5AM6F2

Micron Technology

FLASH

INDUSTRIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

524288 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G44

5.5 V

3 mm

12.6 mm

Not Qualified

BOTTOM

8388608 bit

4.5 V

BOTTOM BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00012 Amp

28.5 mm

YES

55 ns

5

YES

M29W160EB7AN6

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

10 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e0

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

M29W640GL90ZF3E

Micron Technology

FLASH

AUTOMOTIVE

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

13 mm

90 ns

3

N28H00CB03E8D51E

Micron Technology

FLASH

MTFDHBE1T6TDG-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1759218604441 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

1.6TX8

1.6T

0 Cel

UNSPECIFIED

R-XXMA-N

14073748835532 bit

TLC NAND TYPE

MTFDDAA064MAM-1J1AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W128GL70N3E

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

20 mA

8192 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

125 Cel

8KX16

8K

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

131072 bit

2.7 V

8/16

e3

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

M29W800FB70N6SE

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

512KX16

512K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

8388608 bit

3 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

70 ns

3

M29W064FT60ZA6E

Micron Technology

M58BW016FB8ZA3F

Micron Technology

FLASH

AUTOMOTIVE

80

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

BALL

PARALLEL

2K,16K

40 mA

524288 words

NO

2.5/3.3,3/3.3

32

GRID ARRAY

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

Not Qualified

BOTTOM

16777216 bit

NOR TYPE

.000005 Amp

YES

80 ns

NO

MTFDDAV480MAV-1AE11ACYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTFDDAK960MAV-1AH12ACYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W400FT55N6SE

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

256KX16

256K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

4194304 bit

3 V

TOP BOOT BLOCK

NOR TYPE

18.4 mm

55 ns

3

MTFDDAT240MAV-1AE1ZAB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAT128MAM

Micron Technology

FLASH

CMOS

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

3.3

M29W640GL90ZS3F

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

13 mm

90 ns

3

M29F200FB55M3T

Micron Technology

FLASH

AUTOMOTIVE

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

131072 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

125 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

YES

DUAL

R-PDSO-G44

Not Qualified

BOTTOM

2097152 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAA128MAM-1J12

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK480MAV-1AH1ZAC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W800FB55ZA6T

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

3.3

YES

3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.0001 Amp

YES

55 ns

YES

M29F400FB5AN6T2

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

262144 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

BOTTOM

4194304 bit

4.5 V

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

M29F400FT5AM62

Micron Technology

FLASH

INDUSTRIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

262144 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G44

5.5 V

3 mm

12.6 mm

Not Qualified

TOP

4194304 bit

4.5 V

30

235

NOR TYPE

.00012 Amp

28.5 mm

YES

55 ns

5

YES

M29W064FT70ZB3F

Micron Technology

FLASH

3

M58WR064KB7AZQ6F

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

4194304 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM

67108864 bit

4

NOR TYPE

.00005 Amp

YES

70 ns

NO

M29W640GL6ANA3F

Micron Technology

FLASH

3

MTFDDAK480MAV-1AE12AB

Micron Technology

FLASH

CMOS

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

5

MTFDDAT120MAV-1AH1ZAB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W640GH6ANB3E

Micron Technology

FLASH

3

RD48F4400L0YDQ0

Micron Technology

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

8, 510

YES

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM/TOP

536870912 bit

4

e0

NOR TYPE

YES

85 ns

NO

MTFDDAA064MAM-1J2

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MT8F132M-7B

Micron Technology

FLASH MODULE

80

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

PARALLEL

ASYNCHRONOUS

1048576 words

32

MICROELECTRONIC ASSEMBLY

1MX32

1M

SINGLE

R-XSMA-N80

Not Qualified

33554432 bit

70 ns

5

MTFDDAK480MBP-2AN1ZABYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

480GX8

480G

0 Cel

SINGLE

R-XSMA-X22

5.5 V

7.2 mm

69.85 mm

4123168604160 bit

4.5 V

LENGTH_MAX

MLC NAND TYPE

100.5 mm

5

MTFDDAK960MAV-2AE1ZAB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W640GH90ZS3E

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

13 mm

90 ns

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.