Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
FLASH MODULE |
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|
Samsung |
FLASH MODULE |
22 |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
2111062325329 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N22 |
5.25 V |
7 mm |
69.85 mm |
16888498602639 bit |
4.75 V |
MLC NAND TYPE |
100.2 mm |
5 |
||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
40 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
20 mA |
1048576 words |
3 |
NO |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Flash Memories |
.8 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
256 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
8388608 bit |
2.7 V |
256 |
e0 |
.00005 Amp |
18.41 mm |
45 ns |
2.7 |
NO |
||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.1 mm |
8 mm |
Not Qualified |
BOTTOM |
67108864 bit |
1.7 V |
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
11 mm |
70 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
2.7 |
|||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
8K,64K |
50 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
8,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
1 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000018 Amp |
YES |
70 ns |
YES |
|||||||||||||||||||||||||||||
Samsung |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
44 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
70 mA |
16777216 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
8, 511 |
YES |
BOTTOM |
R-PBGA-B44 |
Not Qualified |
BOTTOM |
268435456 bit |
NOR TYPE |
.00007 Amp |
YES |
70 ns |
YES |
||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
128K |
35 mA |
2147483648 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
16K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
17179869184 bit |
2K |
.0001 Amp |
25 ns |
NO |
|||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32MX16 |
32M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
2 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
TOP |
536870912 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE |
e1 |
NOR TYPE |
11 mm |
110 ns |
1.8 |
|||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
55 mA |
16777216 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
BOTTOM |
R-PBGA-B44 |
1.95 V |
1 mm |
6.2 mm |
Not Qualified |
BOTTOM/TOP |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
NOR TYPE |
7.7 mm |
100 ns |
1.8 |
||||||||||||||||||||||||||||||||
Samsung |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
e0 |
NOR TYPE |
9 mm |
80 ns |
2.7 |
|||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.1 mm |
8 mm |
Not Qualified |
TOP |
67108864 bit |
1.7 V |
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
11 mm |
70 ns |
1.8 |
||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
2 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
BOTTOM |
536870912 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE |
e1 |
NOR TYPE |
11 mm |
110 ns |
1.8 |
|||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B44 |
1.95 V |
1 mm |
Not Qualified |
BOTTOM |
134217728 bit |
1.7 V |
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
70 ns |
1.8 |
|||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
8MX16 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B |
1.95 V |
Not Qualified |
134217728 bit |
1.7 V |
e0 |
80 ns |
1.8 |
|||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
48 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
2.7 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
DUAL |
R-PDSO-G48 |
2.9 V |
.7 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.5 V |
CONTAINS ADDITIONAL 32M BIT SPARE MEMORY |
15.4 mm |
30 ns |
2.7 |
|||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
8,63 |
YES |
YES |
BOTTOM |
R-PBGA-B44 |
3 |
1.95 V |
1 mm |
100000 Write/Erase Cycles |
5 mm |
Not Qualified |
TOP |
33554432 bit |
1.7 V |
260 |
NOR TYPE |
.00005 Amp |
7.5 mm |
YES |
70 ns |
1.8 |
YES |
|||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
8,63 |
YES |
YES |
BOTTOM |
R-PBGA-B44 |
1.95 V |
1 mm |
100000 Write/Erase Cycles |
5 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.7 V |
NOR TYPE |
.00005 Amp |
7.5 mm |
YES |
70 ns |
1.8 |
YES |
|||||||||||||||||||
|
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
55 mA |
2097152 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-25 Cel |
16,62 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
Not Qualified |
BOTTOM/TOP |
33554432 bit |
8 |
260 |
NOR TYPE |
.00003 Amp |
YES |
55 ns |
YES |
|||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
18.4 mm |
3.3 |
|||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
8K |
20 mA |
8388608 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Flash Memories |
.8 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
1K |
YES |
YES |
DUAL |
R-PDSO-G40 |
3 |
Not Qualified |
67108864 bit |
512 |
260 |
.00005 Amp |
35 ns |
NO |
|||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
63 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
64K |
45 mA |
268435456 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX16 |
256M |
-30 Cel |
4K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
Not Qualified |
4294967296 bit |
1K |
e1 |
260 |
SLC NAND TYPE |
.0001 Amp |
76 ns |
NO |
||||||||||||||||||||||||||
|
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
167 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,64K |
55 mA |
16777216 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA167,12X15,32 |
Flash Memories |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
4,255 |
YES |
YES |
BOTTOM |
R-PBGA-B167 |
3 |
Not Qualified |
BOTTOM |
268435456 bit |
240 |
NOR TYPE |
.00002 Amp |
YES |
100 ns |
YES |
||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
8,63 |
YES |
YES |
BOTTOM |
R-PBGA-B44 |
3 |
1.95 V |
1 mm |
100000 Write/Erase Cycles |
5 mm |
Not Qualified |
TOP |
33554432 bit |
1.7 V |
260 |
NOR TYPE |
.00005 Amp |
7.5 mm |
YES |
70 ns |
1.8 |
YES |
|||||||||||||||||
|
Samsung |
FLASH |
INDUSTRIAL |
52 |
VBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
4294967296 words |
3.3 |
NO |
3.3 |
8 |
GRID ARRAY |
LGA52(UNSPEC) |
Flash Memories |
1 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
16K |
YES |
YES |
BOTTOM |
R-XBGA-B52 |
3.6 V |
1 mm |
12 mm |
Not Qualified |
34359738368 bit |
2.7 V |
4K |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
17 mm |
25 ns |
3 |
NO |
|||||||||||||||||||||
Samsung |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10 mm |
Not Qualified |
2147483648 bit |
1.65 V |
2K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.00005 Amp |
13 mm |
30 ns |
1.8 |
NO |
||||||||||||||||||||
Samsung |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1073741824 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
105 Cel |
1GX8 |
1G |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
8589934592 bit |
2.7 V |
SLC NAND TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
8 |
SMALL OUTLINE |
16 |
1.27 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
3.1 mm |
12.6 mm |
Not Qualified |
8388608 bit |
4.5 V |
NOR TYPE |
28.5 mm |
90 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
44 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
70 mA |
8388608 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
8, 255 |
YES |
YES |
BOTTOM |
R-PBGA-B44 |
Not Qualified |
BOTTOM |
134217728 bit |
NOR TYPE |
.00005 Amp |
YES |
70 ns |
YES |
|||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
64K |
30 mA |
134217728 words |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX16 |
128M |
0 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
2147483648 bit |
1K |
.00005 Amp |
30 ns |
NO |
||||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
2.65 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
32MX16 |
32M |
-30 Cel |
BOTTOM |
R-PBGA-B63 |
2.9 V |
1 mm |
9.5 mm |
Not Qualified |
536870912 bit |
2.4 V |
SYNCHRONOUS BURST OPERATION IS POSSIBLE |
12 mm |
76 ns |
2.7 |
|||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
16MX8 |
16M |
0 Cel |
UNSPECIFIED |
R-XXMA-X22 |
3.6 V |
Not Qualified |
134217728 bit |
2.7 V |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
55 mA |
16777216 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA44,8X14,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
4,255 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B44 |
2 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
NOR TYPE |
.00002 Amp |
9 mm |
YES |
100 ns |
1.8 |
YES |
|||||||||||||||||
|
Samsung |
FLASH |
OTHER |
67 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
64K |
40 mA |
33554432 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA67,8X10,32 |
Flash Memories |
.8 mm |
85 Cel |
32MX16 |
32M |
-30 Cel |
512 |
YES |
MATTE TIN |
YES |
BOTTOM |
R-PBGA-B67 |
1 |
Not Qualified |
536870912 bit |
1K |
e3 |
SLC NAND TYPE |
.00005 Amp |
11 ns |
NO |
|||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA88,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
8,127 |
YES |
BOTTOM |
R-PBGA-B88 |
3 |
1.95 V |
1.1 mm |
8 mm |
Not Qualified |
BOTTOM |
67108864 bit |
1.7 V |
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
8 |
260 |
NOR TYPE |
.00005 Amp |
11 mm |
YES |
70 ns |
1.8 |
YES |
||||||||||||||||||
Samsung |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
134217728 bit |
1.65 V |
CONTAINS ADDITIONAL 4M BIT NAND FLASH |
SLC NAND TYPE |
8.5 mm |
30 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.1 mm |
8 mm |
Not Qualified |
TOP |
67108864 bit |
1.7 V |
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
11 mm |
70 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
167 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
1.8 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
BOTTOM |
R-PBGA-B167 |
1.95 V |
1.4 mm |
10.5 mm |
Not Qualified |
TOP |
536870912 bit |
1.7 V |
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
14 mm |
110 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
INDUSTRIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
8K |
15 mA |
8388608 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
67108864 bit |
512 |
SLC NAND TYPE |
.00005 Amp |
35 ns |
NO |
|||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
167 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,64K |
55 mA |
16777216 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA167,12X15,32 |
Flash Memories |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
4,255 |
YES |
YES |
BOTTOM |
R-PBGA-B167 |
Not Qualified |
TOP |
268435456 bit |
NOR TYPE |
.00002 Amp |
YES |
100 ns |
YES |
|||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
8MX8 |
8M |
0 Cel |
UNSPECIFIED |
R-XXMA-X22 |
3.6 V |
Not Qualified |
67108864 bit |
2.7 V |
CONTAINS ADDITIONAL 2M BIT NAND FALSH |
35 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
8K,64K |
50 mA |
4194304 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
70 Cel |
4MX16 |
4M |
0 Cel |
8,127 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
TOP |
67108864 bit |
NOR TYPE |
.00003 Amp |
YES |
70 ns |
YES |
||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
44 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
55 mA |
16777216 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
BOTTOM |
R-PBGA-B44 |
1.95 V |
1 mm |
6.2 mm |
Not Qualified |
BOTTOM/TOP |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
NOR TYPE |
7.7 mm |
100 ns |
1.8 |
||||||||||||||||||||||||||||||||
|
Samsung |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.