Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MZ-V8V1T0BW

Samsung

FLASH MODULE

MZ7L31T9HBLT-00A07

Samsung

FLASH MODULE

22

XMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

2111062325329 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

1.92TX8

1.92T

0 Cel

UNSPECIFIED

R-XXMA-N22

5.25 V

7 mm

69.85 mm

16888498602639 bit

4.75 V

MLC NAND TYPE

100.2 mm

5

K9F8008W0M-TCB0

Samsung

FLASH

COMMERCIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K

20 mA

1048576 words

3

NO

3/5

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Flash Memories

.8 mm

70 Cel

1MX8

1M

0 Cel

256

YES

TIN LEAD

YES

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

8388608 bit

2.7 V

256

e0

.00005 Amp

18.41 mm

45 ns

2.7

NO

K8A6515EBC-SE7C0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8D3216UTCYI0900

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

33554432 bit

2.7 V

NOR TYPE

18.4 mm

90 ns

2.7

K8D1716UTB-YC07

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K,64K

50 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

1MX16

1M

0 Cel

8,31

YES

YES

DUAL

R-PDSO-G48

1

Not Qualified

TOP

16777216 bit

NOR TYPE

.000018 Amp

YES

70 ns

YES

K9F2808U0C-HIB0

Samsung

K8S5615EBA-DC7C

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

8, 511

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00007 Amp

YES

70 ns

YES

K9WAG08U1A-YCB0T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

35 mA

2147483648 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

2GX8

2G

0 Cel

16K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

17179869184 bit

2K

.0001 Amp

25 ns

NO

K8F1315ETM-SE1F0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2

1.95 V

1 mm

9 mm

Not Qualified

TOP

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e1

NOR TYPE

11 mm

110 ns

1.8

K8S5515EZC-SC1D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8D6316UTMTI0800

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

67108864 bit

2.7 V

e0

NOR TYPE

9 mm

80 ns

2.7

K8A6315ETC-SE7B0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8F1215EBM-DC1F0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2

1.95 V

1 mm

9 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e1

NOR TYPE

11 mm

110 ns

1.8

K8S2815EBE-DE7C0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

BOTTOM

134217728 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K8A2815ETB-EC7C

Samsung

FLASH

COMMERCIAL

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY

70 Cel

8MX16

8M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B

1.95 V

Not Qualified

134217728 bit

1.7 V

e0

80 ns

1.8

K9T1G08B0M-VCB00

Samsung

FLASH

COMMERCIAL

48

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

2.7

8

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

128MX8

128M

0 Cel

DUAL

R-PDSO-G48

2.9 V

.7 mm

12 mm

Not Qualified

1073741824 bit

2.5 V

CONTAINS ADDITIONAL 32M BIT SPARE MEMORY

15.4 mm

30 ns

2.7

K8S3215ETF-HC7DT

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

3

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

260

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8S3215EBF-DC7CT

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8S5615ETB-FE1CT

Samsung

K8P3215UQB-DE4AT

Samsung

FLASH

OTHER

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

2MX16

2M

-25 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B48

3

Not Qualified

BOTTOM/TOP

33554432 bit

8

260

NOR TYPE

.00003 Amp

YES

55 ns

YES

K9F2G08U0C-SCB00

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

256MX8

256M

0 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

2147483648 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

18.4 mm

3.3

K9F6408U0C-QCB0

Samsung

FLASH

COMMERCIAL

40

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K

20 mA

8388608 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Flash Memories

.8 mm

70 Cel

8MX8

8M

0 Cel

1K

YES

YES

DUAL

R-PDSO-G40

3

Not Qualified

67108864 bit

512

260

.00005 Amp

35 ns

NO

KFH4G16Q2A-DEB8S

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

45 mA

268435456 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX16

256M

-30 Cel

4K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3

Not Qualified

4294967296 bit

1K

e1

260

SLC NAND TYPE

.0001 Amp

76 ns

NO

K8S2615ETE-SC7BT

Samsung

K8C5515EBM-FE1C0

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8S3215ETF-SC7D

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

3

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

260

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K9WBG08U1M-IIB00

Samsung

FLASH

INDUSTRIAL

52

VBGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

256K

35 mA

4294967296 words

3.3

NO

3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

1 mm

85 Cel

4GX8

4G

-40 Cel

16K

YES

YES

BOTTOM

R-XBGA-B52

3.6 V

1 mm

12 mm

Not Qualified

34359738368 bit

2.7 V

4K

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

17 mm

25 ns

3

NO

K9F2808Q0C-HCB0

Samsung

K9F2G08R0A-JCB00

Samsung

FLASH

COMMERCIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

268435456 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

256MX8

256M

0 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

10 mm

Not Qualified

2147483648 bit

1.65 V

2K

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.00005 Amp

13 mm

30 ns

1.8

NO

K9K8G08U0F-SHB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

1073741824 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

105 Cel

1GX8

1G

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

8589934592 bit

2.7 V

SLC NAND TYPE

18.4 mm

2.7

KM28N800G-T9

Samsung

FLASH

COMMERCIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

5

8

SMALL OUTLINE

16

1.27 mm

70 Cel

1MX8

1M

0 Cel

DUAL

R-PDSO-G44

5.5 V

3.1 mm

12.6 mm

Not Qualified

8388608 bit

4.5 V

NOR TYPE

28.5 mm

90 ns

5

K8S2815EBC-DE7DT

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K9F2G16U0M-PCB0

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

64K

30 mA

134217728 words

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

128MX16

128M

0 Cel

2K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

2147483648 bit

1K

.00005 Amp

30 ns

NO

KFG1216D2A-DEB50

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

2.65

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-30 Cel

BOTTOM

R-PBGA-B63

2.9 V

1 mm

9.5 mm

Not Qualified

536870912 bit

2.4 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

12 mm

76 ns

2.7

SMFV016

Samsung

FLASH CARD

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

16777216 words

3.3

8

MICROELECTRONIC ASSEMBLY

55 Cel

16MX8

16M

0 Cel

UNSPECIFIED

R-XXMA-X22

3.6 V

Not Qualified

134217728 bit

2.7 V

35 ns

2.7

K8F5615EBM-SE1E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B44

2

1.95 V

1 mm

8 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

NOR TYPE

.00002 Amp

9 mm

YES

100 ns

1.8

YES

KFG1216Q2B-SEB6

Samsung

FLASH

OTHER

67

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

40 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA67,8X10,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

512

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B67

1

Not Qualified

536870912 bit

1K

e3

SLC NAND TYPE

.00005 Amp

11 ns

NO

K8A6415EBC-SE7C0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

3

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8

260

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

1.8

YES

K9F2808Q0C-BIB0

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

134217728 bit

1.65 V

CONTAINS ADDITIONAL 4M BIT NAND FLASH

SLC NAND TYPE

8.5 mm

30 ns

1.8

K8A6215ETC-HE7E0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8C1015ETM-DC1E0

Samsung

FLASH

COMMERCIAL

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

14 mm

110 ns

1.8

K9F6408Q0C-HIB0

Samsung

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K

15 mA

8388608 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

8MX8

8M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

67108864 bit

512

SLC NAND TYPE

.00005 Amp

35 ns

NO

K8C5415ETM-DE1D0

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K9S6408V0C-SSB00

Samsung

FLASH CARD

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

8388608 words

3.3

8

MICROELECTRONIC ASSEMBLY

55 Cel

8MX8

8M

0 Cel

UNSPECIFIED

R-XXMA-X22

3.6 V

Not Qualified

67108864 bit

2.7 V

CONTAINS ADDITIONAL 2M BIT NAND FALSH

35 ns

2.7

K8D6316UTM-FC07

Samsung

FLASH

COMMERCIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

50 mA

4194304 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

67108864 bit

NOR TYPE

.00003 Amp

YES

70 ns

YES

K8S5515EZC-DC1C0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8A5715ETC-SC1FT

Samsung

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.