Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
STANDARD SRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512X8 |
512 |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDIP-T16 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
150 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
256X8 |
256 |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
2048 bit |
e0 |
.000001 Amp |
900 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
OTHER |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
SMALL OUTLINE |
SOP20,.4 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512X8 |
512 |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDSO-G20 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
150 ns |
||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
186 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
SMALL OUTLINE |
SOP20,.4 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512X8 |
512 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDSO-G20 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
350 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
INDUSTRIAL |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
72 mA |
16777216 words |
COMMON |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA24,5X5,40 |
1 mm |
85 Cel |
16MX8 |
16M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B24 |
3 |
1.95 V |
1 mm |
166 MHz |
6 mm |
134217728 bit |
1.7 V |
.0004 Amp |
8 mm |
|||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
.1 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X8 |
256 |
1 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
2048 bit |
e0 |
.000001 Amp |
200 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
110 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
256X8 |
256 |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
2048 bit |
e0 |
.000001 Amp |
900 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
512X8 |
512 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDIP-T16 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
350 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
.5 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP20,.4 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256X8 |
256 |
1 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
2048 bit |
e0 |
.000001 Amp |
200 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
.5 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
256X8 |
256 |
1 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
2048 bit |
e0 |
.000001 Amp |
200 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
512X8 |
512 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDIP-T16 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
150 ns |
||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
504X8 |
504 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
COMMON |
3/5 |
8 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512X8 |
512 |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1, (MUXED) |
R-PDIP-T16 |
Not Qualified |
4096 bit |
e0 |
.000001 Amp |
150 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
HYPERRAM |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
44 mA |
67108964 words |
COMMON |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA24,5X5,40 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B24 |
3 |
2 V |
1 mm |
200 MHz |
6 mm |
536870912 bit |
1.7 V |
NO |
.004 Amp |
8 mm |
||||||||||||||||||
|
Infineon Technologies |
HYPERRAM |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
44 mA |
67108964 words |
COMMON |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA24,5X5,40 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B24 |
3 |
2 V |
1 mm |
200 MHz |
6 mm |
536870912 bit |
1.7 V |
NO |
.004 Amp |
8 mm |
|||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
HYPERRAM |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
44 mA |
67108964 words |
COMMON |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA24,5X5,40 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B24 |
3 |
2 V |
1 mm |
200 MHz |
6 mm |
536870912 bit |
1.7 V |
NO |
.004 Amp |
8 mm |
|||||||||||||||||
|
Infineon Technologies |
HYPERRAM |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
44 mA |
67108964 words |
COMMON |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA24,5X5,40 |
1 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B24 |
3 |
2 V |
1 mm |
200 MHz |
6 mm |
536870912 bit |
1.7 V |
NO |
.004 Amp |
8 mm |
||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.5 |
36 |
GRID ARRAY |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
37748736 bit |
1.42 V |
e1 |
23 mm |
3.3 ns |
||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1330 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
3 |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.