Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
|||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
|||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
DUAL |
R-PDSO-J44 |
5.5 V |
3.76 mm |
10.16 mm |
4194304 bit |
4.5 V |
28.6 mm |
12 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
8 mA |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
.0001 Amp |
250 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
.3 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
16384 bit |
.00006 Amp |
3000 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
15 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
SRAMs |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
16384 bit |
.0001 Amp |
150 ns |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
e1 |
8 mm |
10 ns |
|||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
.3 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-XDIP-T8 |
Not Qualified |
16384 bit |
.00006 Amp |
3000 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
QFP |
PLASTIC/EPOXY |
YES |
GULL WING |
PARALLEL |
SYNCHRONOUS |
210 mA |
32768 words |
COMMON |
5 |
5 |
9 |
FLATPACK |
QFP44(UNSPEC) |
SRAMs |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
Not Qualified |
294912 bit |
e0 |
8.5 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
16 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
.00004 Amp |
150 ns |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
e1 |
8 mm |
10 ns |
|||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
16 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
2048 bit |
.00004 Amp |
200 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
262144 bit |
.02 Amp |
55 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
|||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.02 Amp |
55 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
4.5 V |
18.56 mm |
10 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
.3 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP8(UNSPEC) |
SRAMs |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
16384 bit |
.00006 Amp |
3000 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
15 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
|||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
16 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
2048 bit |
.00004 Amp |
200 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
770 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
200 MHz |
19 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.3 Amp |
19 mm |
9 ns |
|||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
.1 mA |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP8(UNSPEC) |
SRAMs |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
4096 bit |
.00006 Amp |
3500 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
16 mA |
512 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
SRAMs |
1.27 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
4096 bit |
.00004 Amp |
100 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
16 mA |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
8192 bit |
.00004 Amp |
150 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
.3 mA |
1024 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
8192 bit |
.00006 Amp |
3000 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
15 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
.0001 Amp |
80 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
325 mA |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.2 Amp |
20 ns |
|||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
16 mA |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
.00004 Amp |
150 ns |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
2MX16 |
2M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e1 |
8 mm |
85 ns |
|||||||||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00009 Amp |
8 mm |
70 ns |
|||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
4MX16 |
4M |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
8 mm |
||||||||||||||||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
30 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.00009 Amp |
8 mm |
85 ns |
||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
17 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
85 ns |
||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
17 mA |
1048576 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.7 V |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
85 ns |
|||||||||||||||
|
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
35 mA |
8388608 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-30 Cel |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
134217728 bit |
1.7 V |
.00025 Amp |
8 mm |
9 ns |
||||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
70 ns |
||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
1048576 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.7 V |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
70 ns |
|||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
17 mA |
1048576 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.7 V |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
85 ns |
|||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
17 mA |
2097152 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.000025 Amp |
8 mm |
85 ns |
|||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.00009 Amp |
8 mm |
70 ns |
||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
4MX16 |
4M |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
8 mm |
||||||||||||||||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
1048576 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.7 V |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
SYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
.000025 Amp |
8 mm |
70 ns |
|||||||||||||||
Infineon Technologies |
STATIC COLUMN DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
e0 |
120 ns |
||||||||||||||||||||||||||
Infineon Technologies |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00012 Amp |
8 mm |
70 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.