Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
25 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
.00005 Amp |
180 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
1.2 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
SRAMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
262144 bit |
.0001 Amp |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
12 mA |
16384 words |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP28,.4 |
SRAMs |
1.27 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
R-PDSO-G28 |
Not Qualified |
131072 bit |
.00015 Amp |
105 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
25 ns |
|||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
.25 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
16384 bit |
.000001 Amp |
3000 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.02 Amp |
55 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
125 Cel |
8MX18 |
8M |
-55 Cel |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
Qualified |
150994944 bit |
1.7 V |
25 mm |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
125 Cel |
4MX36 |
4M |
-55 Cel |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
Qualified |
150994944 bit |
1.7 V |
25 mm |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
1 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
YES |
.008 Amp |
8 mm |
10 ns |
||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
.5 mm |
85 Cel |
3-STATE |
8KX16 |
8K |
1.7 V |
-40 Cel |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
1 mm |
6 mm |
131072 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
YES |
.000006 Amp |
6 mm |
65 ns |
|||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
16384 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
.5 mm |
85 Cel |
3-STATE |
16KX16 |
16K |
1.7 V |
-40 Cel |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
1 mm |
6 mm |
262144 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
YES |
.000006 Amp |
6 mm |
90 ns |
|||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
40 mA |
16384 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
.5 mm |
85 Cel |
3-STATE |
16KX16 |
16K |
1.7 V |
-40 Cel |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
1 mm |
6 mm |
262144 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
YES |
.000006 Amp |
6 mm |
65 ns |
|||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
.5 mm |
85 Cel |
3-STATE |
8KX16 |
8K |
1.7 V |
-40 Cel |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
1 mm |
6 mm |
131072 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
YES |
.000006 Amp |
6 mm |
65 ns |
|||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
4096 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
.5 mm |
85 Cel |
3-STATE |
4KX16 |
4K |
1.7 V |
-40 Cel |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
1 mm |
6 mm |
65536 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
YES |
.000006 Amp |
6 mm |
90 ns |
|||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
54 |
SSOP |
RECTANGULAR |
200k Rad(Si) |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP54,.56,32 |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
DUAL |
1 |
R-PDSO-G54 |
1 |
3.6 V |
3.038 mm |
11.836 mm |
16777216 bit |
2.2 V |
YES |
.05 Amp |
22.403 mm |
10 ns |
||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
QFP |
PLASTIC/EPOXY |
YES |
GULL WING |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
FLATPACK |
QFP44(UNSPEC) |
SRAMs |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
Not Qualified |
294912 bit |
e0 |
9 ns |
||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1430 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.59 Amp |
27 mm |
13 ns |
|||||||||
Infineon Technologies |
TIN LEAD |
1 |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
262144 words |
COMMON |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
3.465 V |
1.9 mm |
100 MHz |
23 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE OR FLOW-THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.075 Amp |
23 mm |
5.2 ns |
|||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
8 mm |
10 ns |
||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
40 mA |
16384 words |
COMMON |
1.8 |
1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,10X10,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
16KX16 |
16K |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B100 |
3 |
1.9 V |
1 mm |
6 mm |
Not Qualified |
262144 bit |
1.7 V |
IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT |
e1 |
30 |
260 |
YES |
.000006 Amp |
6 mm |
65 ns |
|||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
SEPARATE |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-J44 |
5.5 V |
3.76 mm |
10.16 mm |
4194304 bit |
4.5 V |
28.6 mm |
15 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
QFP |
PLASTIC/EPOXY |
YES |
GULL WING |
PARALLEL |
SYNCHRONOUS |
210 mA |
32768 words |
COMMON |
5 |
5 |
9 |
FLATPACK |
QFP44(UNSPEC) |
SRAMs |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
Not Qualified |
294912 bit |
e0 |
11.5 ns |
||||||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
16777216 bit |
2.2 V |
18.4 mm |
10 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
4.5 V |
18.56 mm |
10 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
.25 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP8(UNSPEC) |
SRAMs |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
16384 bit |
.000001 Amp |
3000 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
QDR II SRAM |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
900 mA |
8388608 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
8MX18 |
8M |
1.7 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
150994944 bit |
1.7 V |
e0 |
NO |
.36 Amp |
25 mm |
||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
4194304 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
16777216 bit |
2.2 V |
22.415 mm |
10 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
4194304 bit |
2.2 V |
e4 |
18.415 mm |
10 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e1 |
8 mm |
10 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-J36 |
3 |
3.6 V |
3.76 mm |
10.16 mm |
4194304 bit |
2.2 V |
23.495 mm |
10 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
e1 |
8 mm |
10 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
690 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
167 MHz |
19 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.3 Amp |
19 mm |
11 ns |
|||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||||
|
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
LGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1700 mA |
4194304 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
LGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-55 Cel |
BOTTOM |
2 |
R-CBGA-N165 |
1 |
1.9 V |
3.07 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
4.5 V |
18.56 mm |
15 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-J44 |
5.5 V |
3.76 mm |
10.16 mm |
4194304 bit |
4.5 V |
28.6 mm |
12 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
4.5 V |
18.56 mm |
15 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G54 |
3 |
2.2 V |
1.2 mm |
10.16 mm |
16777216 bit |
1.65 V |
22.415 mm |
10 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
780 mA |
65536 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
64KX36 |
64K |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
167 MHz |
17 mm |
Not Qualified |
2359296 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.35 Amp |
17 mm |
4 ns |
|||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
SEPARATE |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
10 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
DUAL |
R-PDSO-J44 |
5.5 V |
3.76 mm |
10.16 mm |
4194304 bit |
4.5 V |
28.6 mm |
10 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.