225 Other Function uPs,uCs & Peripheral ICs 20

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-L1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.5 mm	13 mm			13 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B225	3	Not Qualified	e1
MC9328MXLVP20R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	13 mm	40	260	13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225	3		e1
MC9328MXLDVP20	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	-30 Cel			BOTTOM	1.6 mm	13 mm			13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
MC9328MXLDVP15	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	-30 Cel			BOTTOM	1.6 mm	13 mm			13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
MC9328MXLDVP15R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	-30 Cel			BOTTOM	1.6 mm	13 mm			13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
MC9328MXLCVP15	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	13 mm	40	260	13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225	3		e1
MC9328MXLDVP20R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	-30 Cel			BOTTOM	1.6 mm	13 mm			13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
MC9328MXLVP15R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	13 mm	40	260	13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225	3		e1
MC9328MXLCVP15R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	85 Cel	-40 Cel			BOTTOM	1.6 mm	13 mm			13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
XA7Z010-1CLG225I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32				TIN SILVER COPPER	N	BOTTOM	1.5 mm	13 mm			13 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B225	3	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.