676 Other Function uPs,uCs & Peripheral ICs 54

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FF676E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676	4		e1
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-1FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z045-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40				TIN LEAD	N	BOTTOM	3.37 mm	27 mm			27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified	e0
AF82801IEM/SLB8P	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40						BOTTOM							308 mA		Other Microprocessor ICs		1 mm	S-PBGA-B676		Not Qualified
AF82801JD/SLG8T	Intel			BALL	676	BGA	SQUARE	PLASTIC	YES		1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM						CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			125 Cel	-40 Cel			BOTTOM	3.37 mm	27 mm	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS					1 mm	S-PBGA-B676
DLPC910ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	0 Cel			BOTTOM	3 mm	27 mm			27 mm	CMOS		1 V		I2C; USB	1 mm	S-PBGA-B676
DLPC410ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V	85 Cel	0 Cel			BOTTOM	3 mm	27 mm	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XQ7Z030-L2RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS					1 mm	S-PBGA-B676	4		e0
XQ7Z045-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z030-2RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z030-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z045-2RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40				TIN LEAD	N	BOTTOM	3.37 mm	27 mm			27 mm	CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified	e0
XC7Z045-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS		1 V			1 mm	S-PBGA-B676

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.