Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Total Dose (V) | Maximum Supply Voltage | No. of Functions | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
1 |
15 dBm |
115 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10 dB |
-40 Cel |
GOLD |
e4 |
6000 MHz |
18000 MHz |
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|
Mini-circuits |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
PHEMT |
1 |
16 dBm |
1.13 |
94 mA |
COMPONENT |
5/6 |
50 ohm |
105 Cel |
16.9 dB |
-40 Cel |
400 MHz |
8000 MHz |
|||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
1 |
15 dBm |
115 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10 dB |
-40 Cel |
GOLD |
e4 |
6000 MHz |
18000 MHz |
||||||
|
Qorvo |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
GAN |
1 |
30 dBm |
3 |
600 mA |
COMPONENT |
-1.9,24 |
DIE OR CHIP |
50 ohm |
23.1 dB |
7900 MHz |
11000 MHz |
|||||||||||
|
Mini-circuits |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
PHEMT |
1 |
12 dBm |
1.22 |
90 mA |
COMPONENT |
6 |
50 ohm |
85 Cel |
20.3 dB |
-40 Cel |
50 MHz |
10000 MHz |
|||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
115 mA |
5 |
LCC12,.2SQ |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
||||||||||||||
|
Mini-circuits |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
E-PHEMT |
1 |
8 dBm |
105 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
19.5 dB |
-40 Cel |
500 MHz |
5000 MHz |
|||||||||
|
Microchip Technology |
NARROW BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
5 dBm |
COMPONENT |
3.3 |
LCC12,.08SQ,16 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
29 dB |
-40 Cel |
MATTE TIN |
HIGH RELIABILITY |
e3 |
2412 MHz |
2484 MHz |
|||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
55 mA |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
7000 MHz |
15000 MHz |
||||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
14 dBm |
83 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
29 dB |
MATTE TIN |
e3 |
400 MHz |
1000 MHz |
||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
15 dBm |
COMPONENT |
5 |
LCC12,.2SQ |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10.5 dB |
-40 Cel |
GOLD OVER NICKEL |
HIGH RELIABILITY |
e4 |
7000 MHz |
15500 MHz |
||||||
|
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
138 mA |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
MATTE TIN |
e3 |
||||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
12 dBm |
60 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
15 dB |
-40 Cel |
MATTE TIN |
e3 |
4000 MHz |
10000 MHz |
|||||||
Texas Instruments |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BICMOS |
1 |
COMPONENT |
3.3 |
LCC12,.08SQ,20 |
50 ohm |
105 Cel |
16 dB |
-40 Cel |
10 MHz |
11000 MHz |
||||||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
412 mA |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
MATTE TIN |
e3 |
||||||||||||||
Harris Semiconductor |
12 |
METAL |
BIPOLAR |
MIL-STD-883 Class B (Modified) |
25 mA |
+-6 |
CAN12,.23 |
RF/Microwave Amplifiers |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
e0 |
|||||||||||||||
Rca Solid State |
12 |
METAL |
BIPOLAR |
MIL-STD-883 Class B (Modified) |
25 mA |
+-6 |
CAN12,.23 |
RF/Microwave Amplifiers |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
e0 |
|||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
5.5 mA |
2.7 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
||||||||||||||
|
Broadcom |
WIDE BAND LOW POWER |
12 |
PLASTIC/EPOXY |
GAAS |
1 |
15 dBm |
15 mA |
COMPONENT |
1/2.85 |
MODULE,12LEAD,.13 |
50 ohm |
RF/Microwave Amplifiers |
11 dB |
CMOS COMPATIBLE |
0 MHz |
1575 MHz |
||||||||||
|
Skyworks Solutions |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
1300 mA |
COMPONENT |
3.6 |
LCC12,.32SQ,75/64 |
50 ohm |
85 Cel |
35 dB |
-40 Cel |
Gold (Au) |
HIGH RELIABILITY |
e4 |
390 MHz |
500 MHz |
|||||||
|
Texas Instruments |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BICMOS |
1 |
20 dBm |
COMPONENT |
3.3 |
LCC12,.08SQ,20 |
100 ohm |
105 Cel |
16 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
10 MHz |
11000 MHz |
||||||||
|
Texas Instruments |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BICMOS |
1 |
20 dBm |
COMPONENT |
3.3 |
LCC12,.08SQ,20 |
100 ohm |
105 Cel |
16 dB |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
e4 |
10 MHz |
11000 MHz |
||||||||
|
Texas Instruments |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
BICMOS |
MIL-PRF-38535; MIL-STD-883 |
1 |
COMPONENT |
3.3 |
50 ohm |
125 Cel |
12.5 dB |
-40 Cel |
RH - 100K Rad(Si) |
10 MHz |
6500 MHz |
|||||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
16 dBm |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
8 dB |
-40 Cel |
GOLD OVER NICKEL |
e4 |
17500 MHz |
25500 MHz |
|||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
115 mA |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
80 mA |
5 |
LCC12,.25SQ |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
20 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
11 dB |
-55 Cel |
GOLD OVER NICKEL |
e4 |
2000 MHz |
18000 MHz |
|||||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
130 mA |
5/6 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
GOLD |
e4 |
|||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
12 dBm |
60 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
15 dB |
-40 Cel |
MATTE TIN |
e3 |
4000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
23 dBm |
80 mA |
COMPONENT |
5 |
LCC12,.25SQ |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
8 dB |
-40 Cel |
GOLD |
HIGH RELIABILITY |
e4 |
2000 MHz |
20000 MHz |
|||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
GAAS |
1 |
16 dBm |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
8 dB |
-40 Cel |
17500 MHz |
25500 MHz |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
115 mA |
5 |
LCC12,.2SQ |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
GAAS |
1 |
5 dBm |
35 mA |
COMPONENT |
3 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
13 dB |
-40 Cel |
GOLD OVER NICKEL |
LOW NOISE |
e4 |
2100 MHz |
2900 MHz |
|||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
GAAS |
1 |
18 dBm |
COMPONENT |
6 |
DIE OR CHIP |
50 ohm |
85 Cel |
21 dB |
-55 Cel |
Gold (Au) |
e4 |
33500 MHz |
46500 MHz |
|||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
3 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
1 |
3 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
||||||||||||||||
|
Analog Devices |
NARROW BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
5 dBm |
5.5 mA |
COMPONENT |
2.7 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10.5 dB |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
850 MHz |
940 MHz |
|||||||
Analog Devices |
NARROW BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
5 dBm |
5.5 mA |
COMPONENT |
2.7 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10.5 dB |
-40 Cel |
TIN LEAD |
e0 |
136 MHz |
174 MHz |
||||||||
|
Analog Devices |
NARROW BAND LOW POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
5 dBm |
5.5 mA |
COMPONENT |
2.7 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
10.5 dB |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
136 MHz |
174 MHz |
|||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
TIN |
e3 |
575 MHz |
960 MHz |
||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
TIN |
e3 |
575 MHz |
960 MHz |
||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
12 |
CERAMIC |
HYBRID |
2 |
10 dBm |
3 |
COMPONENT |
3.5 |
LCC12(UNSPEC) |
50 ohm |
RF/Microwave Amplifiers |
100 Cel |
-30 Cel |
IT CAN ALSO OPERATE AT 1710 TO 1785 MHZ |
880 MHz |
915 MHz |
|||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
25 dBm |
1.38 |
300 mA |
COMPONENT |
3.3 |
LCC12,.08SQ,20 |
50 ohm |
125 Cel |
30 dB |
2300 MHz |
4200 MHz |
||||||||||
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
COMPONENT |
3.3 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
26 dB |
-40 Cel |
Matte Tin (Sn) |
e3 |
2400 MHz |
2500 MHz |
|||||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
227 mA |
5 |
LCC12,.12SQ,20 |
RF/Microwave Amplifiers |
Matte Tin (Sn) |
e3 |
|||||||||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
178 mA |
5 |
SOLCC12,.12,20 |
RF/Microwave Amplifiers |
MATTE TIN |
e3 |
|||||||||||||||
|
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
14 dBm |
77 mA |
COMPONENT |
5 |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
23.6 dB |
Matte Tin (Sn) |
e3 |
1800 MHz |
2200 MHz |
RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.
The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.
RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.