Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
2 mm |
SPI |
16777216 bit |
1.65 V |
e4 |
NOR TYPE |
.00005 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
5 mm |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.000025 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
70 MHz |
3 mm |
2097152 bit |
1.65 V |
4.4 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
2 mm |
SPI |
16777216 bit |
1.65 V |
NOR TYPE |
.00005 Amp |
3 mm |
1.8 |
||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
66 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 528 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
|||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
125 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
120 MHz |
3.9 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
4.9 mm |
3.3 |
|||||||||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
4194304 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
SPI |
33554432 bit |
3 V |
2.7V TO 3V @ 120 MHZ |
NOR TYPE |
.00004 Amp |
4.9 mm |
3.3 |
||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
128MX1 |
128M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-G8 |
1 |
1.95 V |
2.16 mm |
133 MHz |
5.28 mm |
134217728 bit |
1.65 V |
e3 |
10 |
260 |
5.28 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.5 mm |
100000 Write/Erase Cycles |
50 MHz |
5.99 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
5.3 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.285 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
5.285 mm |
2.7 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
1.8 |
|||||||||||||||||||||||
Transcend Information |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
34359738368 words |
8 |
UNCASED CHIP |
DIE OR CHIP |
85 Cel |
32GX8 |
32G |
-25 Cel |
SINGLE |
R-XUUC-N8 |
SPI |
274877906944 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
104 MHz |
5.23 mm |
16777216 bit |
2.7 V |
IT ALSO OPERATES AT FREQUENCY 50 MHZ AT SUPPLY VOLTAGE 2.3 TO 2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
5.23 mm |
2.7 |
|||||||||||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
8 |
HVSON |
RECTANGULAR |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,32 |
20 |
.8 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
120 MHz |
3 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
4 mm |
3.3 |
||||||||||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8388608 words |
3.3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
120 MHz |
3.9 mm |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
104 MHz |
5 mm |
4194304 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
2.7 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
75 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE |
R-PDSO-N8 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
134217728 bit |
1.7 V |
30 |
260 |
NOR TYPE |
.00003 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
120 MHz |
5.23 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
5.28 mm |
3 |
||||||||||||||||||||||||
Microchip Technology |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
100 |
1.27 mm |
125 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000045 Amp |
4.9 mm |
3 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
104 MHz |
5 mm |
4194304 bit |
2.3 V |
6 mm |
3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
131072 words |
3 |
8 |
SMALL OUTLINE |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
50 MHz |
1048576 bit |
2.3 V |
30 |
260 |
NOR TYPE |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
108 MHz |
5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
4 |
Flash Memories |
20 |
1.27 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.28 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
.0003 Amp |
5.28 mm |
3 |
||||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
INDUSTRIAL |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
4GX8 |
4G |
-40 Cel |
UPPER |
R-XUUC-N8 |
3.6 V |
1.1 mm |
100 MHz |
11 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
15 mm |
3.3 |
||||||||||||||||||||||||||||||||||
Microchip Technology |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
100 |
1.27 mm |
125 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000045 Amp |
4.9 mm |
3 |
||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
16777216 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
GRID ARRAY |
BGA8,3X5,23 |
100 |
.886 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
BOTTOM |
1 |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
1.95 V |
.64 mm |
100000 Write/Erase Cycles |
104 MHz |
SPI |
16777216 bit |
1.65 V |
NOR TYPE |
.000005 Amp |
1.8 |
||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
16777216 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
16777216 bit |
1.65 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
4.9 mm |
1.8 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.23 mm |
16777216 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.23 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
262144 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
2 mm |
SPI |
2097152 bit |
1.65 V |
NOR TYPE |
.0000145 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
262144 words |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
85 MHz |
3.9 mm |
SPI |
2097152 bit |
1.65 V |
NOR TYPE |
.0000145 Amp |
4.925 mm |
1.8 |
|||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
ORGANIZED AS 4096 PAGES OF 256 BYTES EACH |
e3 |
260 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
8 ms |
16777216 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
4.9 mm |
3.3 |
||||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
29 mA |
8388608 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
67108864 bit |
1.65 V |
e3 |
10 |
260 |
NOR TYPE |
.000035 Amp |
6 mm |
1.8 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
133 MHz |
5 mm |
67108864 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
10 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
2MX4 |
2M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
104 MHz |
2 mm |
8388608 bit |
1.65 V |
IT IS ALSO CONFIGURED AS 8M X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
108 MHz |
5.285 mm |
33554432 bit |
2.7 V |
30 |
260 |
5.285 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
4.9 mm |
3.3 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
1.95 V |
2.16 mm |
100000 Write/Erase Cycles |
104 MHz |
5.28 mm |
Not Qualified |
SPI |
67108864 bit |
1.65 V |
e3 |
NOR TYPE |
.00002 Amp |
5.28 mm |
1.8 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1048576 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
80 MHz |
3.9 mm |
8388608 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.85 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Adesto Technologies |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
20 mA |
524288 words |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
50 MHz |
Not Qualified |
SPI |
4194304 bit |
NOR TYPE |
.00002 Amp |
2.7 |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
262144 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256KX1 |
256K |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
104 MHz |
3.9 mm |
262144 bit |
2.3 V |
4.925 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16.5 mA |
2097152 words |
3.3 |
16 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.24 mm |
SPI |
33554432 bit |
2.7 V |
ALSO OPERATES AT 108MHZ @1.65V MINIMUM SUPPLY |
e4 |
NOR TYPE |
.00005 Amp |
5.29 mm |
3.3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.