Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
UV PLD |
Industrial |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
36.83 mm |
16 |
||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
18 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
66 MHz |
16 |
220 °C (428 °F) |
16 |
||||||||||||||
Altera |
UV PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Ceramic |
35 ns |
Yes |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X1.0 |
Programmable Logic Devices |
No |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-XQFP-G100 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
24.13 mm |
No |
52 |
|||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
65 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
28 Macrocells |
23.2 MHz |
16.51 mm |
24 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
100 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
5.25 V |
128 |
CMOS |
5 |
5 V |
Grid Array |
PGA100M,13X13 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P100 |
1 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
No |
64 |
|||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
17 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
32 Macrocells; Shared Input/Clock; Shared Product Terms |
71.4 MHz |
11.43 mm |
16 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
128 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
No |
52 |
|||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
No |
5.25 V |
192 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA84M,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
1 |
4.96 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
66.7 MHz |
220 °C (428 °F) |
27.94 mm |
No |
64 |
||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
38 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.75 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
e0 |
37 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.826 mm |
11.43 mm |
No |
Stand-Alone Microsequencer |
e0 |
20 MHz |
220 °C (428 °F) |
11.43 mm |
0 |
||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
33.3 MHz |
27.94 mm |
64 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
22 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
No |
55.6 MHz |
16 |
|||||||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Gull Wing |
100 |
WQFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Window |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-CQFP-G100 |
2.99 mm |
14 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
40 MHz |
19.2 mm |
64 |
||||||||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
20 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
16 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.334 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
100 MHz |
8 |
220 °C (428 °F) |
24.13 mm |
8 |
||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
33.3 MHz |
36.83 mm |
16 |
|||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
CMOS |
38535Q/M;38534H;883B |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
320 |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
16 Macrocells |
e0 |
22.2 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
37 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.334 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
28.6 MHz |
31.75 mm |
16 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Macrocell |
4.5 V |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
No |
e0 |
50 MHz |
64 |
|||||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Ceramic |
Yes |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQCC-J44 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
12 ns |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.75 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
125 MHz |
52.07 mm |
24 |
|||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P100 |
3.81 mm |
33.528 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
33.528 mm |
64 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Registered |
4.75 V |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.334 mm |
7.62 mm |
No |
Stand-Alone Microsequencer |
e0 |
25 MHz |
220 °C (428 °F) |
36.83 mm |
0 |
||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
35 ns |
No |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
24 Macrocells |
e0 |
33.3 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
50 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
No |
48 Macrocells; 4 External Clocks; Shared Input/Clock |
22.2 MHz |
48 |
||||||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
128 |
CMOS |
38535Q/M;38534H;883B |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
24.13 mm |
No |
52 |
||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
50 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
24 Macrocells |
23.8 MHz |
52.07 mm |
24 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
48 Macrocells; Shared Input/Clock |
22.2 MHz |
27.94 mm |
48 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P84 |
4.96 mm |
27.94 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
66.7 MHz |
27.94 mm |
64 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
33.3 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
33 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T40 |
5.75 mm |
15.24 mm |
No |
24 Macrocells; 2 External Clocks |
41.7 MHz |
52.07 mm |
24 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
50 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
24 Macrocells |
23.8 MHz |
16.51 mm |
24 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
22 ns |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
62.5 MHz |
32 mm |
16 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
84 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P84 |
4.96 mm |
28.448 mm |
No |
192 Macrocells; 12 Labs |
62.5 MHz |
28.448 mm |
64 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Gull Wing |
208 |
QFP |
Square |
Ceramic |
20 ns |
Yes |
256 |
CMOS |
5 |
5 V |
Flatpack |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
No |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQFP-G208 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
UV PLD |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
Yes |
CMOS |
Chip Carrier, Window |
Macrocell |
1.27 mm |
4 Dedicated Inputs, 20 I/O |
4 |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
20 Macrocells |
16.51 mm |
20 |
||||||||||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
50 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
28 Macrocells |
28.5 MHz |
16.51 mm |
24 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
50 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
48 Macrocells; Shared Input/Clock |
22.2 MHz |
24.13 mm |
48 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
100 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P100 |
4.96 mm |
33.528 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
40 MHz |
33.528 mm |
64 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.826 mm |
11.43 mm |
No |
Stand-Alone Microsequencer |
e0 |
20 MHz |
220 °C (428 °F) |
11.43 mm |
0 |
||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Ceramic |
30 ns |
Yes |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-J44 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
PGA |
Square |
85 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Grid Array |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 48 I/O |
11 |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P68 |
No |
12.2 MHz |
48 |
|||||||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
90 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
48 Macrocells |
e0 |
220 °C (428 °F) |
24.13 mm |
No |
48 |
||||||||||||
Altera |
UV PLD |
Military |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
29.21 mm |
No |
64 |
|||||||||||
Altera |
UV PLD |
Military |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
43 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T40 |
5.588 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
25 MHz |
52.07 mm |
24 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.