Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Total Dose (V) | Maximum Supply Voltage | No. of Functions | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
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Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
40 |
GAN |
1 |
31 dBm |
1.54 |
COMPONENT |
LCC40,.24SQ,20 |
50 ohm |
85 Cel |
27 dB |
-40 Cel |
4800 MHz |
6000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
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|
Analog Devices |
WIDE BAND HIGH POWER |
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|
Analog Devices |
WIDE BAND HIGH POWER |
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|
Analog Devices |
WIDE BAND HIGH POWER |
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Analog Devices |
WIDE BAND HIGH POWER |
36 dBm |
2 |
MODULE |
50 ohm |
60 Cel |
21 dB |
-30 Cel |
2000 MHz |
6000 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
1 |
10.5 dBm |
225 mA |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
30 dB |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
10000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
1 |
COMPONENT |
5 |
SOLCC8,.11,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
17.5 dB |
-40 Cel |
Matte Tin (Sn) |
LOW NOISE |
e3 |
400 MHz |
4000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
30 dBm |
COMPONENT |
50 ohm |
85 Cel |
25.5 dB |
-40 Cel |
MATTE TIN |
e3 |
9000 MHz |
10500 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
10 |
GAN |
1 |
33 dBm |
6 |
COMPONENT |
28 |
DIE OR CHIP |
50 ohm |
85 Cel |
23 dB |
-40 Cel |
2000 MHz |
6000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
16.5 dB |
-40 Cel |
10 MHz |
1100 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
24 dB |
-40 Cel |
MATTE TIN |
e3 |
12000 MHz |
16000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
16.5 dB |
-40 Cel |
10 MHz |
1100 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
30 dBm |
6 |
COMPONENT |
50 ohm |
85 Cel |
18 dB |
-40 Cel |
6000 MHz |
18000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
10 |
PLASTIC/EPOXY |
GAN |
1 |
34 dBm |
COMPONENT |
3.2 |
FL10(UNSPEC) |
50 ohm |
85 Cel |
26 dB |
-40 Cel |
2700 MHz |
3200 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
15 dBm |
COMPONENT |
50 ohm |
85 Cel |
20 dB |
-55 Cel |
6000 MHz |
10000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
30 dBm |
COMPONENT |
50 ohm |
85 Cel |
25.5 dB |
-40 Cel |
MATTE TIN |
e3 |
9000 MHz |
10500 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
27 dBm |
COMPONENT |
50 ohm |
85 Cel |
26 dB |
-55 Cel |
Gold (Au) |
e4 |
12000 MHz |
16000 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
1 |
8 dBm |
6 |
4000 mA |
COMPONENT |
12,28 |
MODULE,6LEAD,2.9 |
50 ohm |
70 Cel |
58 dB |
-40 Cel |
2000 MHz |
6000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
33 dBm |
6 |
COMPONENT |
50 ohm |
85 Cel |
21 dB |
-40 Cel |
2000 MHz |
6000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
1 |
7 |
LCC32,.2SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
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|
Analog Devices |
WIDE BAND HIGH POWER |
GAN |
1 |
36 dBm |
7 |
1100 mA |
COMPONENT |
48 |
DIE OR CHIP |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
8.5 dB |
-55 Cel |
Gold (Au) |
e4 |
10 MHz |
10000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
35 dBm |
COMPONENT |
50 ohm |
85 Cel |
24.5 dB |
-55 Cel |
400 MHz |
6000 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
5 dBm |
2 |
MODULE |
50 ohm |
64 Cel |
53 dB |
-20 Cel |
TTL COMPATIBLE |
5800 MHz |
18000 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
30 dBm |
150 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
29 dB |
-40 Cel |
2700 MHz |
3800 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
30 dBm |
150 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
29 dB |
-40 Cel |
2700 MHz |
3800 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
36 dBm |
2 |
MODULE |
50 ohm |
60 Cel |
21 dB |
-30 Cel |
2000 MHz |
6000 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
1 |
15 dBm |
COMPONENT |
7 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
15 dB |
-40 Cel |
TIN LEAD |
e0 |
6000 MHz |
9500 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
25 dB |
-40 Cel |
MATTE TIN |
e3 |
5500 MHz |
8500 MHz |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
1 |
7 |
LCC24,.2SQ,25 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
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Analog Devices |
WIDE BAND HIGH POWER |
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Analog Devices |
WIDE BAND HIGH POWER |
5 dBm |
2 |
MODULE |
50 ohm |
50 Cel |
85 dB |
10 Cel |
TTL COMPATIBLE |
2000 MHz |
6000 MHz |
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Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
1 |
7 |
LCC32,.2SQ,20 |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
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|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
1 |
15 dBm |
COMPONENT |
7 |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
15 dB |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
6000 MHz |
9500 MHz |
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STMicroelectronics |
WIDE BAND HIGH POWER |
20 |
COAXIAL |
85 Cel |
18 dB |
-20 Cel |
340 MHz |
520 MHz |
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|
STMicroelectronics |
WIDE BAND HIGH POWER |
COAXIAL |
85 Cel |
-20 Cel |
380 MHz |
512 MHz |
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NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
16.25 dBm |
435 mA |
COMPONENT |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
18.2 dB |
-20 Cel |
LOW NOISE |
40 MHz |
900 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
22 dB |
-20 Cel |
LOW NOISE |
40 MHz |
550 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
20.8 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
750 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
22 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
600 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
21.25 dBm |
410 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
20.5 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
870 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
435 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
22 dB |
-20 Cel |
Gold (Au) |
LOW NOISE, HIGH RELIABILITY |
e4 |
40 MHz |
900 MHz |
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|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
240 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
18.5 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
750 MHz |
|||||||||||
NXP Semiconductors |
WIDE BAND HIGH POWER |
1.3 |
MODULE |
75 ohm |
40 MHz |
860 MHz |
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NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
35 dB |
-20 Cel |
LOW NOISE |
40 MHz |
550 MHz |
||||||||||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
19 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
860 MHz |
|||||||||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
410 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
20.8 dB |
-20 Cel |
Gold (Au) |
LOW NOISE, HIGH RELIABILITY |
e4 |
40 MHz |
750 MHz |
RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.
The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.
RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.