Infineon Technologies Cellphone ICs 55

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
OC2321VQFN8XTMA2	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.24		1.27 mm	105 Cel	-40 Cel		DUAL	R-PDSO-N8	1	.9 mm	6 mm					5 mm
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e4			1.1 mm
BGA7H1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA725L6E6327FTSA1/SAMPLE	Infineon Technologies	BASEBAND CIRCUIT
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER							BOTTOM	R-XBCC-B6	1
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGS14MPA9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT																						1
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER							BOTTOM	R-XBCC-B10	1
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGA7L1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER							BOTTOM	R-XBCC-B10	1
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.5 mm
CMY191	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm				DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified				3 mm
BGM1044N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMH0819	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N24		.9 mm	3.5 mm	Not Qualified	e0			4.5 mm
PMB2208	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.014 mA	3.6 V	2.7/4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified			260	7.8 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
CMH192	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N20		.9 mm	3.5 mm	Not Qualified				3.5 mm
BGSA20VGL8E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGM1143N9E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGSX24MU16	Infineon Technologies																							3
BGM14HBA12	Infineon Technologies	RF AND BASEBAND CIRCUIT
CMY91	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE			.95 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.3 mm	Not Qualified	e0			2.9 mm
BGSA20UGL8E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGM1044N7E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
BGA9H1MN9	Infineon Technologies	TELECOM CIRCUIT
CMY212	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel		DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified				2.9 mm
BGC100GN6	Infineon Technologies
PMB2202	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.6 V	2.7/4.5	SMALL OUTLINE	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
CMY213	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified	e0			2.9 mm
BGM12LBA9	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGS16MA12E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT																						1
BGSX22GN10	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B10		.4 mm	1.1 mm					1.5 mm
CMY82	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm			TIN LEAD	QUAD	R-PQCC-N24		.9 mm	3.5 mm	Not Qualified	e0			4.5 mm
BGM13HBA9	Infineon Technologies	RF AND BASEBAND CIRCUIT
PMB2411	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
CMH82	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N20		.9 mm	3.5 mm	Not Qualified				3.5 mm
OC1120-0810VQFN8	Infineon Technologies	BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		10 mA	1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			1.27 mm	85 Cel	-25 Cel		DUAL	R-PQCC-N8		.9 mm	5 mm					6 mm
OC1120-0810WLB25	Infineon Technologies	BASEBAND CIRCUIT		BALL	25		SQUARE		YES	1		10 mA	1.8 V						85 Cel	-25 Cel		BOTTOM	R-XBGA-B25		.43 mm	2.554 mm					2.926 mm
BGSX24MU16E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	16	HLGA	SQUARE	UNSPECIFIED	YES	1	RFCMOS		2.8 V		GRID ARRAY, HEAT SINK/SLUG	LGA16,5X5,16		.4 mm	85 Cel	-40 Cel		BOTTOM	S-XBGA-N16	3	.64 mm	2 mm					2 mm
BGSX22G5A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	RFCMOS		2.8 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.04X.05,16		.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10	1	.65 mm	1.1 mm					1.5 mm
SP000942752	Infineon Technologies	BASEBAND CIRCUIT
BGA735L16	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16		.4 mm	2.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGA713L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.4 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA735L16E6327XTSA1	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16		.4 mm	2.3 mm					2.3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.