Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
FLASH |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
4294967296 words |
8 |
GRID ARRAY |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
536870912 bit |
1.7 V |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||||||
Toshiba |
FLASH CARD |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
4294967296 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
34359738368 bit |
2.7 V |
13 mm |
|||||||||||||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
68719476736 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
68719476736 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
Kingston Technology Company |
FLASH CARD |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
4294967296 words |
8 |
GRID ARRAY |
4GX8 |
4G |
BOTTOM |
R-PBGA-B |
34359738368 bit |
MLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||||
Kingston Technology Company |
FLASH CARD |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY |
16GX8 |
16G |
BOTTOM |
R-PBGA-B |
137438953472 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
NO |
1.8,3/3.3 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
-40 Cel |
32K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
274877906944 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,64K |
50 mA |
4194304 words |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
4,63 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
67108864 bit |
8 |
NOR TYPE |
.000055 Amp |
YES |
65 ns |
NO |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
8589934592 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
68719476736 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
Kingston Technology Company |
FLASH CARD |
INDUSTRIAL |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
4294967296 words |
8 |
GRID ARRAY |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B |
1 mm |
11.5 mm |
34359738368 bit |
MLC NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
268435456 bit |
1.7 V |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
24 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2147483648 words |
1.8 |
1 |
GRID ARRAY |
105 Cel |
2GX1 |
2G |
-40 Cel |
BOTTOM |
S-PBGA-B24 |
3 |
2 V |
166 MHz |
2147483648 bit |
1.7 V |
NOR TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
3.6 V |
536870912 bit |
2.7 V |
96 ns |
3 |
||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
OTHER |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
4294967296 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B |
34359738368 bit |
3.3V SUPPLY IS ALSO AVAILABLE |
NAND TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
17179869184 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
137438953472 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
4294967296 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
34359738368 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
34359738368 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
274877906944 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
68719476736 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
549755813888 bit |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
17179869184 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
16K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
137438953472 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
4294967296 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
34359738368 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
34359738368 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
274877906944 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3.3 |
16 |
GRID ARRAY |
85 Cel |
256MX16 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
4294967296 bit |
e1 |
30 |
260 |
SLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY |
BGA24,5X5,40 |
1 |
20 |
1 mm |
105 Cel |
NO |
8MX8 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
2 V |
1.2 mm |
133 MHz |
6 mm |
SPI |
67108864 bit |
1.7 V |
.00009 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY |
BGA24,5X5,40 |
1 |
20 |
1 mm |
105 Cel |
NO |
8MX8 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
2 V |
1.2 mm |
133 MHz |
6 mm |
SPI |
67108864 bit |
1.7 V |
.00009 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
GRID ARRAY |
BGA8,3X5,23 |
100 |
.886 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
BOTTOM |
1 |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
1.95 V |
.64 mm |
100000 Write/Erase Cycles |
104 MHz |
SPI |
16777216 bit |
1.65 V |
NOR TYPE |
.000005 Amp |
1.8 |
||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
274877906944 bit |
MLC NAND TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
137438953472 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
8589934592 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
70 Cel |
8GX8 |
8G |
0 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
68719476736 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
512K |
50 mA |
1073741824 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
8589934592 bit |
4K |
SLC NAND TYPE |
.00005 Amp |
20 ns |
NO |
||||||||||||||||||||||||||||||
Toshiba |
FLASH |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
60 mA |
134217728 words |
1.8 |
1.8 |
8 |
GRID ARRAY |
BGA24,5X5,40 |
Flash Memories |
20 |
1 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B24 |
100000 Write/Erase Cycles |
133 MHz |
Not Qualified |
SPI |
1073741824 bit |
NOR TYPE |
.00005 Amp |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
512K |
50 mA |
2147483648 words |
NO |
3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
17179869184 bit |
4K |
SLC NAND TYPE |
.00005 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,64K |
51 mA |
16777216 words |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
268435456 bit |
4 |
NOR TYPE |
.000115 Amp |
YES |
85 ns |
NO |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
15 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
GRID ARRAY |
85 Cel |
128MX1 |
128M |
-40 Cel |
BOTTOM |
S-PBGA-B15 |
2 V |
166 MHz |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
8589934592 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
70 Cel |
8GX8 |
8G |
0 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
68719476736 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
24 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2147483648 words |
1.8 |
1 |
GRID ARRAY |
105 Cel |
2GX1 |
2G |
-40 Cel |
BOTTOM |
S-PBGA-B24 |
3 |
2 V |
166 MHz |
2147483648 bit |
1.7 V |
NOR TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
BGA |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
1073741824 words |
8 |
GRID ARRAY |
105 Cel |
1GX8 |
1G |
-40 Cel |
BOTTOM |
X-PBGA-B |
8589934592 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
63 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
Not Qualified |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
12000 ns |
3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,64K |
50 mA |
8388608 words |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
134217728 bit |
8 |
NOR TYPE |
.000055 Amp |
YES |
65 ns |
NO |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
16777216 words |
1.8 |
8 |
GRID ARRAY |
85 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
134217728 bit |
1.7 V |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY |
105 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
536870912 bit |
1.7 V |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA14,4X6,20 |
2 |
20 |
.5 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B14 |
2 V |
.45 mm |
133 MHz |
67108864 bit |
1.65 V |
64MX1BIT |
NOR TYPE |
.000005 Amp |
1.8 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
1073741824 words |
1.8 |
8 |
GRID ARRAY |
105 Cel |
1GX8 |
1G |
-40 Cel |
BOTTOM |
X-PBGA-B |
8589934592 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
27 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
536870912 words |
1.8 |
1 |
GRID ARRAY |
85 Cel |
512MX1 |
512M |
-40 Cel |
BOTTOM |
R-PBGA-B27 |
2 V |
166 MHz |
536870912 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
1.8 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.