Micron Technology Flash Memory 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT28F016S5VG-9

Micron Technology

FLASH

COMMERCIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

64K

50 mA

2097152 words

5

NO

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP40,.8,20

Flash Memories

.5 mm

70 Cel

2MX8

2M

0 Cel

32

YES

TIN LEAD

YES

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

16777216 bit

4.5 V

DEEP POWER DOWN; USER CONFIGURABLE 5V OR 12V VPP

e0

NOR TYPE

.00001 Amp

18.4 mm

90 ns

5

NO

MT28F320J3FS-11MET

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

80 mA

2097152 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

32

YES

TIN LEAD SILVER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

33554432 bit

2.7 V

4/8

e0

NOR TYPE

.00012 Amp

13 mm

YES

110 ns

2.7

NO

MT29F16G08ADACAH4-IT:C

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

256K

35 mA

2147483648 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

2GX8

2G

-40 Cel

8K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

17179869184 bit

2.7 V

4K

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

2.7

NO

MT29F16G08CBACAWP:C

Micron Technology

FLASH

SLC NAND TYPE

3.3

MT29F1G01ABAFDSF-AAT:F

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

1073741824 words

3.3

1

SMALL OUTLINE

105 Cel

1GX1

1G

-40 Cel

DUAL

R-PDSO-G16

1073741824 bit

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

3.3

MT29F1G08AACWPET:C

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128MX8

128M

-40 Cel

TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

1073741824 bit

2.7 V

e3

SLC NAND TYPE

18.4 mm

3.3

MT29F1G08ABBDAHC-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

134217728 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

10.5 mm

Not Qualified

1073741824 bit

1.7 V

2K

e1

SLC NAND TYPE

.00005 Amp

13 mm

25 ns

1.8

NO

MT29F1G16ABBEAH4-AITX:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

1073741824 bit

1.7 V

SLC NAND TYPE

11 mm

1.8

MT29F2G08ABAEAH4-AITX:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

268435456 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

2147483648 bit

2.7 V

2K

e1

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

2.7

NO

MT29F2G08ABAGAWP-IT:GTR

Micron Technology

FLASH

INDUSTRIAL

PLASTIC/EPOXY

1

CMOS

ASYNCHRONOUS

268435456 words

8

85 Cel

256MX8

256M

-40 Cel

2147483648 bit

SLC NAND TYPE

MT29F2G08ABBGAH4-IT:G

Micron Technology

FLASH

30

260

SLC NAND TYPE

1.8

MT29F2G16ABBEAH4-AAT:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

128MX16

128M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

2147483648 bit

1.7 V

SLC NAND TYPE

11 mm

1.8

MT29F2G16ABBEAH4-IT:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

20 mA

134217728 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

Not Qualified

2147483648 bit

1.7 V

1K

30

260

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

1.8

NO

MT29F32G08CBACAWP:C

Micron Technology

MT29F4G08ABADAH4-IT

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

2.7

MT29F4G08ABAEAWP:E

Micron Technology

FLASH

SLC NAND TYPE

3.3

MT29F4G08ABBFAH4-AIT:F

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

256K

35 mA

536870912 words

1.8

NO

8

GRID ARRAY, VERY THIN PROFILE

BGA63,10X12,32

10

.8 mm

85 Cel

512MX8

512M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

100000 Write/Erase Cycles

9 mm

4294967296 bit

1.7 V

4K

SLC NAND TYPE

.00005 Amp

11 mm

NO

MT29F4G16ABADAH4:D

Micron Technology

FLASH

COMMERCIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

35 mA

268435456 words

3.3

NO

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

256MX16

256M

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

4294967296 bit

2.7 V

1K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

NO

MT29F8G08ABABAWP-AITX:B

Micron Technology

FLASH

SLC NAND TYPE

3.3

MT35XU01GBBA1G12-0SITTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

128MX8

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

200 MHz

6 mm

SPI

1073741824 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

MT35XU02GCBA1G12-0AUTTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

200 MHz

6 mm

SPI

2147483648 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

MT35XU02GCBA2G12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

2147483648 bit

1.7 V

e1

30

260

8 mm

1.8

MT35XU256ABA1G12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

256MX1

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

e1

30

260

8 mm

1.8

MT35XU512ABA1G12-0SITTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

200 MHz

6 mm

SPI

536870912 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

MTFC16GAKAEEF-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

169

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

NO

8

GRID ARRAY, THIN PROFILE

BGA169,14X28,20

.5 mm

105 Cel

16GX8

16G

-40 Cel

NO

GOLD OVER NICKEL

YES

BOTTOM

R-PBGA-B169

3.6 V

1.2 mm

52 MHz

14 mm

137438953472 bit

2.7 V

e4

NAND TYPE

18 mm

2.7

NO

MTFC16GAPALNA-AITTR

Micron Technology

FLASH CARD

TIN SILVER COPPER

30

260

2.7

MTFC16GJGEF-AITZ

Micron Technology

FLASH CARD

INDUSTRIAL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,14X14,20

.5 mm

85 Cel

16GX8

16G

-40 Cel

BOTTOM

R-PBGA-B169

3.6 V

1.364 mm

52 MHz

14 mm

137438953472 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NAND TYPE

18 mm

MTFC32GAKAECN-AIT

Micron Technology

FLASH CARD

2.7

MTFC32GAKAEEF-AIT

Micron Technology

FLASH CARD

Gold (Au) - with Nickel (Ni) barrier

e4

30

260

2.7

MTFC32GASAQHD-IT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

5

.5 mm

85 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

200 MHz

11.5 mm

274877906944 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

MTFC4GLWDM-4MAATZ

Micron Technology

FLASH CARD

MTFC4GMWDM-3MAITATR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

2.7

MTFC64GAPALNA-AITTR

Micron Technology

FLASH CARD

TIN SILVER COPPER

30

260

2.7

MTFC64GASAONS-AITES

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

95 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1.461 mm

52 MHz

11.5 mm

549755813888 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NAND TYPE

13 mm

MTFC64GASAQHD-IT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

5

.5 mm

85 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

200 MHz

11.5 mm

549755813888 bit

2.7 V

NAND TYPE

13 mm

MTFC64GAZAQHD-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

1.95 V

.9 mm

200 MHz

11.5 mm

549755813888 bit

1.7 V

NAND TYPE

13 mm

1.8

MTFC64GAZAQHD-WT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

85 Cel

64GX8

64G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

549755813888 bit

2.7 V

NAND TYPE

13 mm

MTFC8GACAALT-4MITTR

Micron Technology

FLASH

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA100,10X17,40

1 mm

85 Cel

OPEN-DRAIN

8GX8

8G

-40 Cel

NO

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

52 MHz

14 mm

68719476736 bit

2.7 V

e1

30

260

MLC NAND TYPE

18 mm

3.3

NO

MTFC8GACAENS-K1AIT

Micron Technology

FLASH CARD

NOT SPECIFIED

NOT SPECIFIED

2.7

MTFC8GLWDQ-3MAITZ

Micron Technology

FLASH CARD

INDUSTRIAL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, LOW PROFILE

BGA100,10X17,40

1 mm

85 Cel

8GX8

8G

-40 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.703 mm

52 MHz

14 mm

68719476736 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NAND TYPE

18 mm

MTFDDAK200MAN-1S1AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDHBE7T6TDF-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

8444249301319 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

7.68TX8

7.68T

0 Cel

UNSPECIFIED

R-XXMA-N

67553994410557 bit

TLC NAND TYPE

MTFDHBE960TDF-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1030792151040 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

960GX8

960G

0 Cel

UNSPECIFIED

R-XXMA-N

8246337208320 bit

TLC NAND TYPE

MTFDJAK800MBS-2AN16FCYY

Micron Technology

FLASH

3.3

MTSD064AHC6MS-1WT

Micron Technology

FLASH CARD

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

68719476736 words

8

UNCASED CHIP

85 Cel

64GX8

64G

-25 Cel

UPPER

R-XUUC-N

549755813888 bit

NOR TYPE

MTSD256AKC7MS-1WT

Micron Technology

NOT SPECIFIED

NOT SPECIFIED

N25Q032A11ESE40G

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1048576 words

1.8

32

SMALL OUTLINE

1.27 mm

85 Cel

1MX32

1M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.16 mm

108 MHz

5.285 mm

33554432 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

5.285 mm

1.8

N25Q032A13E1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

32MX1

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

33554432 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.