Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
2097152 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
2MX8 |
2M |
0 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
16777216 bit |
4.5 V |
DEEP POWER DOWN; USER CONFIGURABLE 5V OR 12V VPP |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
90 ns |
5 |
NO |
|||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
3 |
NO |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
32 |
YES |
TIN LEAD SILVER |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
33554432 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
13 mm |
YES |
110 ns |
2.7 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
2147483648 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
17179869184 bit |
2.7 V |
4K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
2.7 |
NO |
||||||||||||||||||||
Micron Technology |
FLASH |
SLC NAND TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
1073741824 words |
3.3 |
1 |
SMALL OUTLINE |
105 Cel |
1GX1 |
1G |
-40 Cel |
DUAL |
R-PDSO-G16 |
1073741824 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
1073741824 bit |
2.7 V |
e3 |
SLC NAND TYPE |
18.4 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
e1 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
1073741824 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e1 |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
2.7 |
NO |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
PLASTIC/EPOXY |
1 |
CMOS |
ASYNCHRONOUS |
268435456 words |
8 |
85 Cel |
256MX8 |
256M |
-40 Cel |
2147483648 bit |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
30 |
260 |
SLC NAND TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
128MX16 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
2147483648 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
1.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||
Micron Technology |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
SLC NAND TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
536870912 words |
1.8 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA63,10X12,32 |
10 |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
100000 Write/Erase Cycles |
9 mm |
4294967296 bit |
1.7 V |
4K |
SLC NAND TYPE |
.00005 Amp |
11 mm |
NO |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
268435456 words |
3.3 |
NO |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX16 |
256M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
2.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
Micron Technology |
FLASH |
SLC NAND TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
200 MHz |
6 mm |
SPI |
1073741824 bit |
1.7 V |
e1 |
30 |
260 |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
200 MHz |
6 mm |
SPI |
2147483648 bit |
1.7 V |
e1 |
30 |
260 |
NOR TYPE |
8 mm |
1.8 |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
200 MHz |
6 mm |
2147483648 bit |
1.7 V |
e1 |
30 |
260 |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
268435456 words |
1.8 |
1 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
256MX1 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
268435456 bit |
1.7 V |
e1 |
30 |
260 |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
200 MHz |
6 mm |
SPI |
536870912 bit |
1.7 V |
e1 |
30 |
260 |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
169 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA169,14X28,20 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
NO |
GOLD OVER NICKEL |
YES |
BOTTOM |
R-PBGA-B169 |
3.6 V |
1.2 mm |
52 MHz |
14 mm |
137438953472 bit |
2.7 V |
e4 |
NAND TYPE |
18 mm |
2.7 |
NO |
|||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
TIN SILVER COPPER |
30 |
260 |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
169 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,14X14,20 |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B169 |
3.6 V |
1.364 mm |
52 MHz |
14 mm |
137438953472 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH CARD |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
30 |
260 |
2.7 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.9 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
NOT SPECIFIED |
NOT SPECIFIED |
2.7 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
TIN SILVER COPPER |
30 |
260 |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
95 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.461 mm |
52 MHz |
11.5 mm |
549755813888 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.9 mm |
200 MHz |
11.5 mm |
549755813888 bit |
2.7 V |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
.9 mm |
200 MHz |
11.5 mm |
549755813888 bit |
1.7 V |
NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
1 |
.5 mm |
85 Cel |
64GX8 |
64G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.9 mm |
11.5 mm |
549755813888 bit |
2.7 V |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X17,40 |
1 mm |
85 Cel |
OPEN-DRAIN |
8GX8 |
8G |
-40 Cel |
NO |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
52 MHz |
14 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
MLC NAND TYPE |
18 mm |
3.3 |
NO |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
NOT SPECIFIED |
NOT SPECIFIED |
2.7 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, LOW PROFILE |
BGA100,10X17,40 |
1 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.703 mm |
52 MHz |
14 mm |
68719476736 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8444249301319 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
7.68TX8 |
7.68T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
67553994410557 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1030792151040 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
960GX8 |
960G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
8246337208320 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
68719476736 words |
8 |
UNCASED CHIP |
85 Cel |
64GX8 |
64G |
-25 Cel |
UPPER |
R-XUUC-N |
549755813888 bit |
NOR TYPE |
||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1048576 words |
1.8 |
32 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
1MX32 |
1M |
-40 Cel |
DUAL |
S-PDSO-G8 |
2 V |
2.16 mm |
108 MHz |
5.285 mm |
33554432 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.285 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3 |
3/3.3 |
1 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
Flash Memories |
20 |
1 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
108 MHz |
6 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e1 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.