Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
536870912 bit |
2.3 V |
ASYNCHRONOUS READ MODE |
e1 |
NOR TYPE |
13 mm |
95 ns |
2.7 |
||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
52 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
UNCASED CHIP |
UPPER |
R-XUUC-N52 |
3.7 mm |
29.85 mm |
MLC NAND TYPE |
50.8 mm |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
20 mA |
262144 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
4194304 bit |
NOR TYPE |
.0001 Amp |
YES |
90 ns |
YES |
|||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
10 mA |
1048576 words |
YES |
2.7/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.0001 Amp |
YES |
80 ns |
YES |
|||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1030792151040 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
960GX8 |
960G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
8246337208320 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
TOP |
16777216 bit |
2.7 V |
NOR TYPE |
8 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
3 mm |
12.6 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
30 |
260 |
NOR TYPE |
.00012 Amp |
28.5 mm |
YES |
55 ns |
5 |
YES |
||||||||||||||||
Micron Technology |
FLASH |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
80 mA |
8388608 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
134217728 bit |
4/8 |
30 |
235 |
NOR TYPE |
.00012 Amp |
YES |
75 ns |
NO |
||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
INDUSTRIAL |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
SERIAL |
ASYNCHRONOUS |
120 mA |
2147483648 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX8 |
2G |
-40 Cel |
UNSPECIFIED |
R-XXMA-X |
5.25 V |
9.7 mm |
26.6 mm |
17179869184 bit |
4.75 V |
SLC NAND TYPE |
.06 Amp |
36.9 mm |
5 |
||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
3 mm |
12.6 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00012 Amp |
28.5 mm |
YES |
55 ns |
5 |
YES |
||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.4 mm |
11 mm |
BOTTOM |
33554432 bit |
2.7 V |
NOR TYPE |
13 mm |
90 ns |
3 |
||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
31 mA |
67108864 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
1K |
YES |
TIN LEAD SILVER |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
1073741824 bit |
2.7 V |
16/32 |
e0 |
NOR TYPE |
.00024 Amp |
13 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
22 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
515396075520 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
SINGLE |
R-XSMA-X22 |
5.5 V |
7.2 mm |
69.85 mm |
4123168604160 bit |
4.5 V |
LENGTH_MAX |
MLC NAND TYPE |
100.5 mm |
5 |
||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
20 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
4/8 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
13 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
TOP |
33554432 bit |
2.5 V |
NOR TYPE |
8 mm |
80 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
20 mA |
262144 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
BOTTOM |
4194304 bit |
NOR TYPE |
.0001 Amp |
YES |
70 ns |
YES |
|||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
BOTTOM |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
8 mm |
70 ns |
3 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
52 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
137438953472 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128GX8 |
128G |
0 Cel |
DUAL |
R-XDMA-N52 |
3.46 V |
3.75 mm |
29.85 mm |
1099511627776 bit |
3.14 V |
MLC NAND TYPE |
50.8 mm |
3.3 |
||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
8192 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
8KX16 |
8K |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
.00007 ms |
131072 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.0001 Amp |
13 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,7X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B56 |
2 V |
1 mm |
7.7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
NOR TYPE |
.00005 Amp |
9 mm |
YES |
70 ns |
1.8 |
NO |
||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
2097152 bit |
NOR TYPE |
.00012 Amp |
YES |
55 ns |
YES |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
22 |
SMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
515396075520 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
480GX8 |
480G |
0 Cel |
SINGLE |
R-XSMA-N22 |
5.5 V |
7 mm |
69.85 mm |
4123168604160 bit |
4.5 V |
MLC NAND TYPE |
100.45 mm |
5 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
22 |
SMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
515396075520 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
480GX8 |
480G |
0 Cel |
SINGLE |
R-XSMA-N22 |
5.5 V |
7 mm |
69.85 mm |
4123168604160 bit |
4.5 V |
MLC NAND TYPE |
100.45 mm |
5 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
CMOS |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
5 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
10 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
4/8 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
75 |
SMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
549755813888 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512GX8 |
512G |
0 Cel |
DUAL |
R-XDMA-N75 |
3.46 V |
3.58 mm |
22 mm |
4398046511104 bit |
3.14 V |
MLC NAND TYPE |
80 mm |
3.3 |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
1,2,1,63 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
Micron Technology |
FLASH |
COMMERCIAL |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
R-XXMA-N |
7 mm |
69.85 mm |
MLC NAND TYPE |
100.2 mm |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
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|
Micron Technology |
FLASH MODULE |
COMMERCIAL |
52 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
549755813888 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512GX8 |
512G |
0 Cel |
DUAL |
HARDWARE |
R-XDMA-N52 |
3.46 V |
3.75 mm |
29.85 mm |
4398046511104 bit |
3.14 V |
MLC NAND TYPE |
50.8 mm |
3.3 |
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|
Micron Technology |
FLASH |
CMOS |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
3.3 |
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Micron Technology |
FLASH |
CMOS |
MLC NAND TYPE |
5 |
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|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
125 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
2.7 V |
e3 |
NOR TYPE |
18.4 mm |
55 ns |
3 |
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Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
33554432 bit |
2.7 V |
18.4 mm |
70 ns |
3 |
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Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
TOP |
16777216 bit |
2.7 V |
NOR TYPE |
8 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
OTHER |
107 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
128K |
50 mA |
8388608 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA107,9X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-30 Cel |
64 |
NO |
BOTTOM |
R-PBGA-B107 |
Not Qualified |
BOTTOM |
134217728 bit |
NOR TYPE |
.00003 Amp |
YES |
96 ns |
NO |
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Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
20 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.00012 Amp |
YES |
55 ns |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.