Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M29W640GH60ZS3E

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

13 mm

60 ns

3

M58WR064KB7AZB6F

Micron Technology

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,7X8,30

Flash Memories

.75 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

2 V

1 mm

7.7 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

4

e1

NOR TYPE

.00005 Amp

9 mm

YES

70 ns

1.8

NO

MTFDHBA960TDF-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1030792151040 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

960GX8

960G

0 Cel

UNSPECIFIED

R-XXMA-N

8246337208320 bit

TLC NAND TYPE

RD48F1000W0YUQ0

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

40 mA

2097152 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

33554432 bit

4

NOR TYPE

.000005 Amp

YES

60 ns

NO

M29F400FT55M32

Micron Technology

FLASH

AUTOMOTIVE

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

262144 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

125 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G44

5.5 V

3 mm

12.6 mm

Not Qualified

TOP

4194304 bit

4.5 V

30

235

NOR TYPE

.00012 Amp

28.5 mm

YES

55 ns

5

YES

M29W064FB60ZB6E

Micron Technology

FLASH

3

MTFDDAK480MAV-2AH12ZZYY

Micron Technology

FLASH MODULE

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.5 mm

5

M29W256GH7AZS1F

Micron Technology

FLASH

COMMERCIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM/TOP

268435456 bit

2.7 V

NOR TYPE

13 mm

70 ns

3

MTFDDAT064MAR-1K11

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

JS48F4400P0VB00A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,64K

51 mA

33554432 words

NO

1.8,1.8/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

DUAL

R-PDSO-G56

Not Qualified

BOTTOM

536870912 bit

4

NOR TYPE

.000005 Amp

YES

95 ns

NO

MTFDDAK050MAR

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W064FT70N6F

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

67108864 bit

2.7 V

NOR TYPE

18.4 mm

70 ns

3

MTFDDAK120MAV-1AE11ACYY

Micron Technology

FLASH

COMMERCIAL

22

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N22

7 mm

69.85 mm

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

100.5 mm

3.3

M29W640GB60NA3F

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

60 ns

3

RC28F640P30BF65B

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

50 mA

4194304 words

NO

1.8,1.8/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

4,63

YES

BOTTOM

S-PBGA-B64

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.000055 Amp

YES

65 ns

NO

MTFDDAK480MAV-1AE11AAHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTFDDAK064MAY-1AH1ZZZYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SERIAL

ASYNCHRONOUS

68719476736 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

64GX8

64G

0 Cel

SINGLE

R-XSMA-X22

5.5 V

7 mm

69.85 mm

549755813888 bit

4.5 V

MLC NAND TYPE

100.5 mm

5

M29W320FB80NSE

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

33554432 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

MTFDDAT256MAM-1K1

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29F800FB5AZA6F-2

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

BALL

PARALLEL

16K,8K,32K,64K

30 mA

524288 words

5

YES

5

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

RC48F4400P0VB0E

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

33554432 words

1.8

NO

1.8,3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

16

Flash Memories

1 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

TIN LEAD SILVER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

52 MHz

10 mm

Not Qualified

BOTTOM/TOP

536870912 bit

1.7 V

ASYNCHRONOUS READ MODE

e0

NOR TYPE

.00042 Amp

13 mm

YES

100 ns

1.8

NO

M29W256GH70ZS1E

Micron Technology

FLASH

COMMERCIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

70 Cel

16MX16

16M

0 Cel

256

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM/TOP

268435456 bit

2.7 V

8/16

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

MTFDDAV256TDL-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

274877906944 words

8

MICROELECTRONIC ASSEMBLY

256GX8

256G

UNSPECIFIED

R-XXMA-X

2199023255552 bit

TLC NAND TYPE

RD48F2000P0ZBQ0

Micron Technology

FLASH

INDUSTRIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B88

2 V

1.2 mm

8 mm

BOTTOM

67108864 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

10 mm

88 ns

1.8

M29W320DB7AZE6F

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

8 mm

YES

70 ns

3

YES

PH28F320W18BE60

Micron Technology

FLASH

INDUSTRIAL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.75 mm

85 Cel

2MX16

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B56

1.95 V

1 mm

7.7 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

NOR TYPE

9 mm

60 ns

1.8

RC28F640P30TF65

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

4MX16

4M

-40 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

TOP

67108864 bit

1.7 V

TOP BOOT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

13 mm

65 ns

1.8

RD48F5000M0YBB0

Micron Technology

FLASH

OTHER

105

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA105,9X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

256

NO

BOTTOM

R-PBGA-B105

Not Qualified

BOTTOM

536870912 bit

16

NOR TYPE

.00003 Amp

YES

96 ns

NO

RD48F4000M0YUB0

Micron Technology

FLASH

OTHER

105

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

16777216 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA105,9X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-30 Cel

128

NO

BOTTOM

R-PBGA-B105

Not Qualified

TOP

268435456 bit

NOR TYPE

.00003 Amp

YES

96 ns

NO

MTFDDAA050MAR-1K1

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

PC48F3000W0YC00

Micron Technology

FLASH

INDUSTRIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

40 mA

8388608 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

8, 255

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

4

NOR TYPE

.000005 Amp

YES

60 ns

NO

MTFDDAT480MAV-2AH11ABYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

RD48F3000P0ZTQ0

Micron Technology

FLASH

INDUSTRIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B88

2 V

1.2 mm

8 mm

TOP

134217728 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

10 mm

88 ns

1.8

M29W160ET70N3F

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

1MX16

1M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

16777216 bit

2.7 V

e3

NOR TYPE

18.4 mm

70 ns

3

MTFDDAT512MAY-1AE12ACHA

Micron Technology

FLASH MODULE

COMMERCIAL

52

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

549755813888 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

512GX8

512G

0 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

4398046511104 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

GE28F160C3TC80

Micron Technology

FLASH

INDUSTRIAL

46

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

18 mA

1048576 words

3

NO

1.8/3.3,3/3.3

16

GRID ARRAY, FINE PITCH

BGA46,6X8,30

Flash Memories

.75 mm

85 Cel

1MX16

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B46

3.6 V

Not Qualified

TOP

16777216 bit

2.7 V

NOR TYPE

.00002 Amp

YES

80 ns

3

NO

M29W320FB7AZA6E6

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

10 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.0001 Amp

8 mm

YES

70 ns

3

YES

MTFDDAT512MAY-1AE1ZACYY

Micron Technology

FLASH MODULE

COMMERCIAL

52

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

549755813888 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

512GX8

512G

0 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

4398046511104 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

MTFDDAV512TDL-1AW12ABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

549755813888 words

8

MICROELECTRONIC ASSEMBLY

512GX8

512G

UNSPECIFIED

R-XXMA-X

4398046511104 bit

TLC NAND TYPE

M29W256GL7AN6F

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

16MX16

16M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

268435456 bit

2.7 V

8/16

e3

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFDHAK400MCG-1AN1ZABYY

Micron Technology

FLASH

CMOS

12

RC28F256P33BF

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

16777216 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

TIN LEAD SILVER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

BOTTOM

268435456 bit

2.3 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE

e0

NOR TYPE

.00021 Amp

13 mm

YES

95 ns

2.7

NO

M29W128GH70ZA3F

Micron Technology

FLASH

AUTOMOTIVE

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

8192 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

125 Cel

8KX16

8K

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

131072 bit

2.7 V

8/16

e1

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

MTFDDAT064MAR-1J11AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29DW256G60ZS6E

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

32K,128K

10 mA

16777216 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

8,126

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

BOTTOM/TOP

268435456 bit

NOR TYPE

.0001 Amp

YES

60 ns

YES

RC48F2000W0YU00

Micron Technology

FLASH

INDUSTRIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

40 mA

4194304 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

67108864 bit

4

NOR TYPE

.000005 Amp

YES

60 ns

NO

M29W800FB5AN6T

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.0001 Amp

YES

55 ns

YES

M29W320FT80ZA3SF6

Micron Technology

FLASH

AUTOMOTIVE

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

10 mA

2097152 words

YES

2.7/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

125 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

33554432 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.