Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Highest Frequency Band | Maximum Pulsed Drain Current (IDM) | Avalanche Energy Rating (EAS) | Maximum Fall Time (tf) | Maximum Drain Current (Abs) (ID) | Nominal Turn Off Time (toff) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Transistor Element Material | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Maximum Gate-Emitter Threshold Voltage | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Nominal Turn On Time (ton) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
250 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
62 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
2.25 ohm |
1.6 A |
QUAD |
R-CQCC-N28 |
Not Qualified |
HIGH RELIABILITY |
40 |
260 |
|||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.28 ohm |
4 A |
SINGLE |
R-PSFM-T12 |
ISOLATED |
Not Qualified |
40 |
260 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.29 ohm |
1.6 A |
DUAL |
R-CDIP-T14 |
HIGH RELIABILITY |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
12 A |
85 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.6 ohm |
3 A |
QUAD |
S-CQCC-N28 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
9.2 A |
75 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
1.1 ohm |
2.3 A |
QUAD |
S-CQCC-N28 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
METAL |
SWITCHING |
200 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
80 A |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.11 ohm |
25 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.29 ohm |
1.6 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
MO-036AB |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
METAL |
SWITCHING |
500 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
40 A |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.43 ohm |
11 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
18.4 A |
70 mJ |
4.6 A |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
44 ns |
-55 Cel |
122 ns |
1.2 ohm |
4.6 A |
QUAD |
S-CQCC-N28 |
MIL-19500 |
|||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
250 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
3.2 A |
50.4 mJ |
.8 A |
14 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
1.1 ohm |
.8 A |
DUAL |
R-PDIP-T14 |
1 |
Not Qualified |
MO-036AB |
|||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.28 ohm |
4 A |
SINGLE |
R-PSFM-T12 |
ISOLATED |
Not Qualified |
40 |
260 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
200 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
44 A |
80 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.18 ohm |
11 A |
QUAD |
S-CQCC-N28 |
AVALANCHE RATED |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.7 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
MO-036AB |
e0 |
||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.3 ohm |
5 A |
SINGLE |
R-PSFM-T12 |
ISOLATED |
Not Qualified |
40 |
260 |
|||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
1.6 A |
14 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.29 ohm |
1.6 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
|||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
1 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.8 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
56 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.7 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
|||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
METAL |
SWITCHING |
100 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
100 A |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.08 ohm |
25 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
125 W |
METAL |
SWITCHING |
500 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
40 A |
11 A |
12 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.43 ohm |
11 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
METAL |
SWITCHING |
500 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
40 A |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.43 ohm |
11 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
11.2 A |
70 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
1.2 ohm |
2.8 A |
QUAD |
S-CQCC-N28 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4.28 A |
13 mJ |
1.07 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.6 ohm |
1.07 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
FAST SWITCHING |
MO-036AB |
e0 |
|||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
18.4 A |
47 mJ |
4.6 A |
28 |
CHIP CARRIER |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.31 ohm |
4.6 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
250 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
7.6 A |
30 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
1.5 ohm |
1.9 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4.28 A |
13 mJ |
1.07 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.6 ohm |
1.07 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
FAST SWITCHING |
MO-036AB |
e0 |
|||||||||||||||||||||||
|
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
9.2 A |
75 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
1.1 ohm |
2.3 A |
QUAD |
S-CQCC-N28 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
250 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
3.2 A |
50.4 mJ |
.8 A |
14 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
1.1 ohm |
.8 A |
DUAL |
R-PDIP-T14 |
1 |
Not Qualified |
MO-036AB |
|||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
56 mJ |
1 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.7 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
|||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.8 ohm |
1 A |
DUAL |
R-CDIP-T14 |
HIGH RELIABILITY |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
12 A |
85 mJ |
3 A |
28 |
CHIP CARRIER |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.6 ohm |
3 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
-55 Cel |
TIN LEAD |
.8 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Not Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
18.4 A |
47 mJ |
4.6 A |
28 |
CHIP CARRIER |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.31 ohm |
4.6 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.29 ohm |
1.6 A |
DUAL |
R-CDIP-T14 |
HIGH RELIABILITY |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.15 ohm |
5 A |
SINGLE |
R-PSIP-T12 |
Not Qualified |
40 |
260 |
||||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.29 ohm |
1.6 A |
DUAL |
R-CDIP-T14 |
HIGH RELIABILITY |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
18.4 A |
47 mJ |
4.6 A |
28 |
CHIP CARRIER |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.31 ohm |
4.6 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.15 ohm |
5 A |
SINGLE |
R-PSFM-T12 |
ISOLATED |
Not Qualified |
40 |
260 |
|||||||||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
METAL |
SWITCHING |
200 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
80 A |
12 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
TIN LEAD |
.11 ohm |
25 A |
DUAL |
R-MDFM-F12 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
12 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
11.2 A |
70 mJ |
2.8 A |
28 |
CHIP CARRIER |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
1.2 ohm |
2.8 A |
QUAD |
S-CQCC-N28 |
Not Qualified |
e0 |
|||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
250 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
62 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
2.25 ohm |
1.6 A |
QUAD |
R-CQCC-N28 |
HIGH RELIABILITY |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
250 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
62 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
2.25 ohm |
1.6 A |
QUAD |
R-CQCC-N28 |
HIGH RELIABILITY |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6.4 A |
130 mJ |
1.8 A |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
37 ns |
-55 Cel |
45 ns |
.29 ohm |
1.8 A |
DUAL |
R-CDIP-T14 |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
RH - 100K Rad(Si) |
|||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.8 ohm |
1 A |
DUAL |
R-CDIP-T14 |
Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
MIL-19500/598 |
||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
SQUARE |
ENHANCEMENT MODE |
4 |
92 A |
73 mJ |
28 |
CHIP CARRIER |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.036 ohm |
23 A |
QUAD |
S-CQCC-N28 |
AVALANCHE RATED |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
3 A |
75 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
1.73 ohm |
.75 A |
DUAL |
R-CDIP-T14 |
Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
MIL-19500/599 |
||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
YES |
9.6 W |
PLASTIC/EPOXY |
SWITCHING |
55 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
24.8 A |
245 mJ |
6.2 A |
28 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
175 Cel |
SILICON |
.033 ohm |
6.2 A |
DUAL |
R-PDSO-G28 |
Not Qualified |
AVALANCHE RATED, LOGIC LEVEL COMPATIBLE |
||||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
1.4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
3 A |
75 mJ |
.75 A |
14 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
1.73 ohm |
.75 A |
DUAL |
R-CDIP-T14 |
Qualified |
HIGH RELIABILITY |
MO-036AB |
e0 |
MIL-19500/599 |
||||||||||||||||||||
|
Infineon Technologies |
N-CHANNEL |
SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
4 A |
75 mJ |
14 |
IN-LINE |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.8 ohm |
1 A |
DUAL |
R-CDIP-T14 |
HIGH RELIABILITY |
MO-036AB |
NOT SPECIFIED |
NOT SPECIFIED |
MIL-19500 |
Power Field Effect Transistors (FET) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as motor drives, power supplies, and switching regulators.
The Power FET is a three-terminal device that works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through a gate electrode. The gate electrode is insulated from the channel region by a thin oxide layer, which can be controlled by applying a voltage to the gate terminal. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.
Power FETs are designed to handle high current and voltage levels, and have a low on-resistance and high switching speed. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.
Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.